AS 60068.2.69:2004
$43.55
Environmental testing – Tests – Test Te: Soldering – Solderability testing of electronic components for surface mount technology by the wetting balance method
| Published By | Publication Date | Number of Pages |
| AS | 2004-06-03 | 28 |
Part of a suite of Standards that adopt the IECĀ 60068 series of Standards as Australian Standards. The series contains fundamental information on environmental testing procedures and severities of tests, including information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the environmental testing procedures are equally applicable to other industrial products.
Scope
This International Standard describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.
The terms used in this standard are those defined in IEC 60068-2-20 and IEC 60068-2-54.
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