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BSI PD IEC TR 60068-3-12:2022

BSI PD IEC TR 60068-3-12:2022

$167.15

Environmental testing – Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Published By Publication Date Number of Pages
BSI 2022 38
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
3 Terms and definitions
4 Determination of an envelope reflow profile
4.1 Temperature-time-envelope curve
10 4.2 Diagram of a theoretical envelope reflow profile
4.3 Key parameters of the envelope reflow profile
Figures
Figure 1 – Schematic envelope reflow profile
Tables
Table 1 – Temperature-time curve – Units
11 Table 2 – Envelope points of a reflow temperature-time-profile
13 5 Temperature profile measurements
5.1 Determining the measurement locations
14 5.2 Selection and attachment of thermocouples
5.2.1 Types of thermocouples
Figure 2 – Recommended temperature measurement locations on a test board
Figure 3 – X-ray of a sheath thermocouple
15 5.2.2 Preparation of thermocouples
5.2.3 Attachment of thermocouples
Figure 4 – Example of a) acceptable and b) unacceptable attachment of the thermocouples
16 Table 3 – Thermocouple attachment methods
17 Figure 5 – Examples of good and bad thermocouple attachment
18 5.2.4 Influence of attachment method and operator on measurement results
5.3 Temperature gradient
5.3.1 Gradient calculation
Figure 6 – Thermocouples (TC) fixed to an LED
Figure 7 – Results of the same test board prepared by different methods
19 Figure 8 – Gradient calculation
20 5.3.2 Sampling rate
5.4 Analysis, comparison and overlay of different reflow profiles and best practice
Figure 9 – Example of a gradient calculation on a temperature-time curve
21 5.5 Measuring equipment
6 Tolerance analysis of the measurement chain
Figure 10 – Overlay of different reflow profiles (origin at oven entry)
Figure 11 – Overlay of different reflow profiles (overlap at start of peak zone)
22 Figure 12 – Measurement chain
Table 4 – Tolerances of the temperature measurement chain
23 7 Optimizing a temperature profile
7.1 General procedure
7.2 Description of a typical test board and the used reflow oven
24 7.3 Schematic envelope reflow profile for the example board
Figure 13 – Description of a test board (electronic assembly)
25 Table 5 – Envelope points at the envelope reflow profile for the test board
26 7.4 Preparation of test board
Figure 14 – Envelope reflow profile for the test board
Figure 15 – Thermal images of the test board after cooling down from 150 °C
27 7.5 Possibility of temperature profiling optimization with simulation tools
Table 6 – Measurement locations on the sample assembly
28 Figure 16 – Geometric and thermal description of the test board
Figure 17 – Geometric and thermal description of the reflow soldering equipment
29 7.6 Iteration steps for finding reflow equipment setup
Figure 18 – Predicted reflow profile with help of simulation (blue band)
30 Table 7 – Settings according to experience
Table 8 – Measurement results for the settings from Table 7
Table 9 – Settings for second run
Table 10 – Measurement results for the settings from Table 9
31 Figure 19 – Overlay envelope curves of the temperature-time curvesof three profiling steps, 0201-chip solder joint
Table 11 – Settings after adjustment of the heating zone temperatures
Table 12 – Measurement results from Table 11, adaptation of heating zone temperatures
32 8 Examples of envelope reflow profiles
8.1 Key data for two different solders
Figure 20 – Overlay envelope curves of the temperature-time curvesof three profiling steps, ERU25 solder joint
33 8.2 Example of a qualification temperature profile for component used in lead-free reflow soldering (SAC)
Table 13 – Examples for envelope reflow profile key data for two different solders
34 Figure 21 – Exemplary qualification reflow temperature profile for the qualification of components intended for use in assemblies with a wide variation of thermal masses
Table 14 – Key parameters for a lead-free SAC reflowtemperature profile for component qualification
35 Bibliography

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BSI PD IEC TR 60068-3-12:2022
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