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BSI PD IEC TR 60068-3-15:2024

BSI PD IEC TR 60068-3-15:2024

$142.49

Environmental testing – Supporting documentation and guidance. Vacuum-assisted reflow soldering

Published By Publication Date Number of Pages
BSI 2024 30
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
4.1 Type of voids
10 4.2 Reasons for voids
Figures
Figure 1 – X-Ray examples of voids in solder joints in different SMD-Components
Figure 2 – Reduction of voids with low flux soldering & preforms
11 4.3 Influence of voiding on solder joint performance
5 Vacuum-assisted soldering processes
5.1 Purpose
5.2 Combination of soldering process with vacuum
12 5.3 Typical temperature-pressure-time curves
5.3.1 Convection soldering with vacuum
Figure 3 – Example of a product for vacuum-assisted soldering processes
Tables
Table 1 – Combination of soldering processes with vacuum
13 5.3.2 Vapour phase soldering with vacuum
Figure 4 – Typical profile – vacuum-assisted convection soldering
14 5.3.3 Contact soldering with vacuum
Figure 5 – Typical profile – vacuum-assisted vapour phase soldering
15 6 Effect of vacuum when reflow soldering
6.1 General
6.1.1 General description
6.1.2 Physical basics
Figure 6 – Typical profile – vacuum-assisted contact soldering
16 6.1.3 Vacuum parameters
6.1.4 Vapour phase vacuum reflow soldering
17 6.2 Components in the vacuum reflow soldering process
6.2.1 Influence of pressure differences
Figure 7 – Vapour pressure curve of Galden®
18 Figure 8 – Pressures to be considered
19 Figure 9 – Vapour pressure curve of water
Table 2 – Molar mass
20 6.2.2 Influence of temperature, time, and vacuum
7 Vacuum equipment restrictions
7.1 General
7.2 Chamber size
21 7.3 Time to reach vacuum level
7.4 Cycle time
7.5 Summary
Table 3 – Combination of soldering processes with vacuum
22 8 Typical defects after vacuum-assisted reflow soldering
8.1 Typical defect modes occurring at components
Figure 10 – Blow Hole Void in/out of metallization
Figure 11 – Gas bubbles at metallization interface
23 Figure 12 – Gas bubble caused by residues in metallization defect
Figure 13 – Blow out void in solder meniscus
24 Figure 14 – Aluminium electrolytic capacitors with non-solid electrolyte, bulged
Figure 15 – Composite housing bursts in case of overpressure
25 Figure 16 – Housing mainly made of plastic bursts in case of overpressure
Figure 17 – Relay lock (polymer dot) blown off
26 8.2 Component defect modes – summary
8.3 Soldering defect modes
8.3.1 Dropping of components
Figure 18 – Housing with adhesive joint bursts in case of overpressure
27 8.3.2 Bridging
8.3.3 Splattering
Figure 19 – An example of bridging on BGA during vacuum assisted soldering
Figure 20 – Optimization with stepwise applying of vacuum to reduce bridging
28 Figure 21 – Splattering due to explosive outgassing from the solder joint
29 Bibliography

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BSI PD IEC TR 60068-3-15:2024
$142.49