{"id":419864,"date":"2024-10-20T06:27:59","date_gmt":"2024-10-20T06:27:59","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-dd-iec-ts-62610-22011-2\/"},"modified":"2024-10-26T12:05:19","modified_gmt":"2024-10-26T12:05:19","slug":"bsi-dd-iec-ts-62610-22011-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-dd-iec-ts-62610-22011-2\/","title":{"rendered":"BSI DD IEC\/TS 62610-2:2011"},"content":{"rendered":"
This part of IEC 62610 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and\/or chassis in accordance with the IEC 60297 and IEC 60917 series.<\/p>\n
This design guide contains the following:<\/p>\n
Thermal interfaces of subrack and\/or chassis based equipment in a cabinet<\/p>\n
Reference temperature<\/p>\n<\/li>\n
Preferred airflow conditions<\/p>\n<\/li>\n
Airflow volume conditions<\/p>\n<\/li>\n
Standard air<\/p>\n<\/li>\n<\/ul>\n<\/li>\n
Procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions<\/p>\n<\/li>\n<\/ol>\n
The drawings used are not intended to indicate product design. They are only explanatory indications for determining forced air-cooling structure.<\/p>\n
The terminology used complies with IEC 60917-1.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
4<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope and object 2 Thermal interfaces 2.1 Baseline thermal conditions 2.2 Reference temperature <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 2.3 Syntax of surfaces of a generic subrack, chassis or cabinet Figure 1 \u2013 Syntax of surfaces of a forced air cooled generic subrackor chassis to be mounted into a cabinet Figure 2 \u2013 Syntax of surfaces of a forced air cooled generic cabinet <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 2.4 Preferred airflow conditions Table 1 \u2013 Preferred airflow pattern <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 2.5 Cabinet airflow volume and temperature rise management Figure 3 \u2013 Preferred air flow patterns <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 3 Forced air thermal flow chart for cabinet equipment 3.1 General Figure 4 \u2013 Air flow volume management <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 3.2 Evaluation of the actual thermal performance of subrack or chassis 3.3 Cabinet airflow considerations 3.4 Arrangement of subracks and\/or chassis equipment within the cabinet Figure 5 \u2013 Forced air thermal flow chart for cabinet equipment <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 3.5 Selection of cabinet mounted forced air device(s) 3.6 Thermal operating environment Figure 6 \u2013 Thermal operating environment (Cabinet sectional side view) <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 7 \u2013 Example of effect of reference temperatureon cabinet operating temperature range <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Annex A (informative) Limitation of application and background information <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure A.1 \u2013 Thermal network model for a plug-in unit in subrack or chassis <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Design guide. Method for the determination of forced air-cooling structure<\/b><\/p>\n |