{"id":580719,"date":"2024-11-05T20:17:47","date_gmt":"2024-11-05T20:17:47","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ipc-tr-5781984\/"},"modified":"2024-11-05T20:17:47","modified_gmt":"2024-11-05T20:17:47","slug":"ipc-tr-5781984","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ipc\/ipc-tr-5781984\/","title":{"rendered":"IPC TR-578:1984"},"content":{"rendered":"

The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:<\/p>\n