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ASTM-F1238:2011 Edition

ASTM-F1238:2011 Edition

$35.75

F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

Published By Publication Date Number of Pages
ASTM 2011 3
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ASTM F1238-95-Reapproved2011

Withdrawn Standard: Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

ASTM F1238

Scope

1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.

1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

Keywords

density; microelectronics; molybdenum disilicide; refractory silicides; sputtering; sputtering targets; tantalum disilicide; titanium disilicide; tungsten disilicide; Electrical conductors (semiconductors)–specifications; Electronic materials/applications–specifications; Metallic silicide; Molybdenum (electronic applications)–specifications; Polycaprolactone (PCL); Refractory silicide targets; Silicides; Tantalum (Ta)/tantalum alloys–specifications; Targets; Titanium silicide; Tungsten silicide (WSix)

ICS Code

ICS Number Code 31.100 (Electronic tubes)

DOI: 10.1520/F1238-95R11

PDF Catalog

PDF Pages PDF Title
1 Scope
Terminology
Ordering Information
Chemical Composition
Physical Properties
2 Dimensions
Workmanship, Finish, and Appearance
Sampling
Analytical Methods
Certification
Product Marking
Packaging
Keywords
TABLE 1
TABLE 2

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