ASTM-F357 2002
$35.75
F357-78(2002) Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
| Published By | Publication Date | Number of Pages |
| ASTM | 2002 | 2 |
ASTM F357-78-Reapproved2002
Withdrawn Standard: Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
ASTM F357
Scope
1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Keywords
hybrid microcircuits; solderability; solder wetting; thick-film metallization
ICS Code
ICS Number Code 29.050 (Superconductivity and conducting materials)
DOI: 10.1520/F0357-78R02
