BS EN 16603-20-07:2022
$215.11
Space engineering. Electromagnetic compatibility
| Published By | Publication Date | Number of Pages |
| BSI | 2022 | 106 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 12 | 1 Scope |
| 13 | 2 Normative references |
| 14 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards |
| 15 | 3.2 Terms specific to the present standard |
| 17 | 3.3 Abbreviated terms |
| 19 | 4 Requirements 4.1 General system requirements 4.2 Detailed system requirements 4.2.1 Overview 4.2.2 EMC with the launch system 4.2.2.1 Overview 4.2.2.2 Detailed system requirements |
| 20 | 4.2.3 Lightning environment 4.2.3.1 Overview 4.2.3.2 Requirements to the space system 4.2.4 Spacecraft charging and effects 4.2.4.1 Overview 4.2.4.2 EMI control requirements to system and equipment in relation with ESD |
| 21 | 4.2.5 Spacecraft DC magnetic emission 4.2.5.1 Spacecraft with susceptible payload 4.2.5.2 Attitude control system (ACS) 4.2.6 Radiofrequency compatibility |
| 22 | 4.2.7 Hazards of electromagnetic radiation 4.2.8 Intrasystem EMC 4.2.9 EMC with ground equipment |
| 23 | 4.2.10 Grounding 4.2.10.1 Overview 4.2.10.2 Requirements 4.2.11 Electrical bonding requirements 4.2.11.1 Overview |
| 24 | 4.2.11.2 Normative provisions 4.2.11.3 External grounds |
| 25 | 4.2.12 Shielding (except wires and cables) 4.2.12.1 Overview 4.2.12.2 Requirements 4.2.13 Wiring (including wires and cables shielding) 4.2.13.1 Classification of cables 4.2.13.2 Cable shields |
| 27 | 5 Verification 5.1 Overview 5.1.1 Introduction 5.1.2 Electromagnetic effects verification plan 5.1.3 Electromagnetic effects verification report 5.2 Test conditions 5.2.1 Measurement tolerances |
| 28 | 5.2.2 Test site 5.2.2.1 Overview 5.2.2.2 Shielded enclosures |
| 29 | 5.2.2.3 Ambient electromagnetic level 5.2.2.4 Ambient conducted level |
| 30 | 5.2.3 Ground plane 5.2.3.1 General 5.2.3.2 Metallic ground plane 5.2.3.3 Composite ground plane 5.2.4 Power source impedance |
| 32 | 5.2.5 General test precautions 5.2.5.1 Safety 5.2.5.2 Excess personnel and equipment 5.2.5.3 Overload precautions 5.2.6 EUT test configurations 5.2.6.1 General |
| 33 | 5.2.6.2 Bonding of EUT 5.2.6.3 Shock and vibration isolators 5.2.6.4 Safety grounds 5.2.6.5 Orientation of EUTs |
| 34 | 5.2.6.6 Construction and arrangement of EUT cables |
| 35 | 5.2.6.7 Electrical and mechanical interfaces 5.2.7 Operation of EUT 5.2.7.1 General |
| 36 | 5.2.7.2 Operating frequencies for tuneable RF equipment 5.2.7.3 Operating frequencies for spread spectrum equipment 5.2.7.4 Susceptibility monitoring 5.2.8 Use of measurement equipment 5.2.8.1 Overview |
| 37 | 5.2.8.2 Detector 5.2.8.3 Calibration fixture (jig) |
| 38 | 5.2.9 Emission testing 5.2.9.1 Bandwidths 5.2.9.2 Emission identification 5.2.9.3 Frequency scanning |
| 39 | 5.2.9.4 Emission data presentation 5.2.10 Susceptibility testing 5.2.10.1 Frequency stepping |
| 40 | 5.2.10.2 Modulation of susceptibility signals |
| 41 | 5.2.10.3 Thresholds of susceptibility 5.2.10.4 Susceptibility data presentation 5.2.11 Calibration of measuring equipment 5.2.11.1 General 5.2.11.2 Measurement system test |
| 42 | 5.2.12 Power bus voltage 5.2.13 Photographic data 5.3 System level 5.3.1 General 5.3.2 Safety margin demonstration for critical or EED circuits |
| 43 | 5.3.3 EMC with the launch system 5.3.4 Lightning 5.3.5 Spacecraft and static charging |
| 44 | 5.3.6 Spacecraft DC magnetic field emission 5.3.7 Intra–system electromagnetic compatibility 5.3.8 Radiofrequency compatibility 5.3.9 Grounding 5.3.10 Electrical bonding 5.3.11 Wiring and shielding |
| 45 | 5.4 Equipment and subsystem level test procedures 5.4.1 Overview 5.4.2 CE, power leads, differential mode, 30 Hz to 100 kHz 5.4.2.1 Purpose 5.4.2.2 Test equipment |
| 46 | 5.4.2.3 Setup 5.4.2.4 Procedure |
| 47 | 5.4.3 CE, power and signal leads, 50 kHz to 100 MHz 5.4.3.1 Purpose |
| 48 | 5.4.3.2 Test equipment 5.4.3.3 Setup |
| 49 | 5.4.3.4 Procedures |
| 50 | 5.4.4 CE, power leads, inrush current 5.4.4.1 Purpose 5.4.4.2 Test equipment |
| 51 | 5.4.4.3 Setup |
| 52 | 5.4.4.4 Procedures |
| 53 | 5.4.4.5 Data presentation 5.4.5 DC Magnetic field emission, magnetic moment 5.4.5.1 Overview |
| 54 | 5.4.5.2 Set-Up 5.4.5.3 Test sequence |
| 55 | 5.4.5.4 Data presentation |
| 56 | 5.4.6 RE, electric field, 30 MHz to 18 GHz 5.4.6.1 Purpose 5.4.6.2 Test equipment |
| 57 | 5.4.6.3 Test setup |
| 59 | 5.4.6.4 Test procedures |
| 60 | 5.4.6.5 Data Presentation 5.4.7 CS, power leads, 30 Hz to 100 kHz 5.4.7.1 Purpose 5.4.7.2 Test equipment |
| 61 | 5.4.7.3 Setup |
| 62 | 5.4.7.4 Procedures |
| 63 | 5.4.8 CS, bulk cable injection, 50 kHz to 100 MHz 5.4.8.1 Purpose 5.4.8.2 Test equipment 5.4.8.3 Setup |
| 64 | 5.4.8.4 Test procedures |
| 67 | 5.4.9 CS, power leads, transients 5.4.9.1 Purpose 5.4.9.2 Test equipment |
| 68 | 5.4.9.3 Setup |
| 70 | 5.4.9.4 Procedures |
| 71 | 5.4.10 RS, magnetic field, 30 Hz to 100 kHz 5.4.10.1 Purpose 5.4.10.2 Test equipment 5.4.10.3 Setup |
| 72 | 5.4.10.4 Test procedures |
| 73 | 5.4.10.5 Data Presentation |
| 74 | 5.4.11 RS, electric field, 30 MHz to 18 GHz 5.4.11.1 Purpose and overview 5.4.11.2 Test equipment |
| 75 | 5.4.11.3 Test setup |
| 78 | 5.4.11.4 Test procedures |
| 80 | 5.4.11.5 Test report content and data presentation |
| 81 | 5.4.12 Susceptibility to wire-coupled electrostatic discharges (legacy method) 5.4.12.1 Overview 5.4.12.2 Test equipment |
| 82 | 5.4.12.3 Setup |
| 84 | 5.4.12.4 Procedure |
| 85 | 5.4.12.5 Data presentation |
| 86 | 5.4.13 Susceptibility to wire-coupled electrostatic discharges (current injection probe method) 5.4.13.1 Overview 5.4.13.2 Test equipment 5.4.13.3 Calibration |
| 88 | 5.4.13.4 EUT testing |
| 89 | 5.4.13.5 Data presentation 5.4.14 Susceptibility to electrostatic discharges into the chassis 5.4.14.1 Overview 5.4.14.2 Test equipment |
| 90 | 5.4.14.3 Test setup 5.4.14.4 Procedure |
| 92 | 5.4.14.5 Data presentation 5.4.15 CE, power leads, time domain 5.4.15.1 Purpose 5.4.15.2 Test equipment 5.4.15.3 Test setup |
| 93 | 5.4.15.4 Procedure 5.4.15.5 Data presentation |
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