Shopping Cart

No products in the cart.

BS EN 60512-28-100:2013

$167.15

Connectors for electronic equipment. Tests and measurements – Signal integrity tests up to 1000 MHz on IEC 60603-7 and IEC 61076-3 series connectors. Tests 28a to 28g

Published By Publication Date Number of Pages
BSI 2013 38
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This part of IEC 60512 specifies the test methods for transmission performance for IEC 60603-7 and IEC 61076-3 series connectors up to 1 000 MHz. It is also suitable for testing lower frequency connectors, however the test methodology specified in the detailed specification for any given connector remains the reference conformance test for that connector.

The test methods provided here are:

  • insertion loss, test 28a;

  • return loss, test 28b;

  • near-end crosstalk (NEXT) test 28c;

  • far-end crosstalk (FEXT), test 28d;

  • transverse conversion loss (TCL), test 28f;

  • transverse conversion transfer loss (TCTL), test 28g.

For the transfer impedance (ZT) test, see IEC 60512-26-100, test 26e.

For the coupling attenuation, see IEC 62153-4-12.

PDF Catalog

PDF Pages PDF Title
7 English
CONTENTS
10 1 Scope
2 Normative references
11 3 Terms, definitions and acronyms
3.1 Terms and definitions
3.2 Acronyms
12 4 Overall test arrangement
4.1 Test instrumentation
4.2 Measurement precautions
13 4.3 Mixed mode S-parameter nomenclature
Figures
Figure 1 – Diagram of a single ended 4 port device
Figure 2 – Diagram of a balanced 2 port device
14 4.4 Coaxial cables and interconnect for network analysers
4.5 Requirements for switching matrices
Tables
Table 1 – Mixed mode S-parameter nomenclature
15 4.6 Test fixture requirements
Figure 3 – Test interface pattern
Table 2 – Switch performance recommendations
16 4.7 Requirements for termination performance at calibration plane
4.8 Reference loads for calibration
Table 3 – Test fixture requirements
Table 4 – Requirements for terminations at calibration plane
17 4.9 Calibration
4.10 Termination loads for termination of conductor pairs
4.10.1 General
Figure 4 – Calibration of reference loads
18 4.10.2 Verification of termination loads
4.11 Termination of screens
4.12 Test specimen and reference planes
4.12.1 General
Figure 5 – Resistor termination networks
19 4.12.2 Interconnections between device under test (DUT) and the calibration plane
Figure 6 – Definition of reference planes
21 4.13 Overall test setup requirements
5 Connector measurement up to 1 000 MHz
5.1 General
Table 5 – Interconnection DM return loss requirements
Table 6 – Overall test setup requirements
22 5.2 Insertion loss, Test 28a
5.2.1 Object
5.2.2 Connecting hardware insertion loss
5.2.3 Test method
5.2.4 Test set-up
5.2.5 Procedure
23 5.2.6 Test report
5.2.7 Accuracy
5.3 Return loss, Test 28b
5.3.1 Object
5.3.2 Connecting hardware return loss
5.3.3 Test method
Figure 7 – Insertion loss and TCTL measurement
24 5.3.4 Test set-up
5.3.5 Procedure
5.3.6 Test report
5.3.7 Accuracy
5.4 Near-end crosstalk (NEXT), Test 28c
5.4.1 Object
5.4.2 Connecting hardware NEXT
5.4.3 Test method
25 5.4.4 Test set-up
5.4.5 Procedure
Figure 8 – NEXT measurement
26 5.4.6 Test report
5.4.7 Accuracy
5.5 Far-end crosstalk (FEXT), Test 28d
5.5.1 Object
5.5.2 Connecting hardware FEXT
5.5.3 Test method
5.5.4 Test set-up
27 5.5.5 Procedure
5.5.6 Test report
5.5.7 Accuracy
Figure 9 – FEXT measurement
28 5.6 Transfer impedance (ZT), Test 28e
5.7 Transverse conversion loss (TCL), Test 28f
5.7.1 Object
5.7.2 Connecting hardware TCL
5.7.3 Test method
5.7.4 Test set-up
5.7.5 Procedure
Figure 10 – Return loss and TCL measurement
29 5.7.6 Test report
5.7.7 Accuracy
5.8 Transverse conversion transfer loss (TCTL), Test 28g
5.8.1 Object
5.8.2 Connecting hardware TCTL
30 5.8.3 Test method
5.8.4 Test set-up
5.8.5 Procedure
5.8.6 Test report
5.8.7 Accuracy
31 5.9 Coupling attenuation
32 Annex A (informative) Example derivation of mixed mode parameters using the modal decomposition technique
Figure A.1 – Voltage and current on balanced DUT
33 Figure A.2 – Voltage and current on unbalanced DUT
35 Annex B (informative) Test pins – Dimensions and references
Figure B.1 – Example of pin and fixed connector dimensions
36 Bibliography
BS EN 60512-28-100:2013
$167.15