BS EN 60749-21:2005
$142.49
Semiconductor devices. Mechanical and climatic test methods – Solderability
| Published By | Publication Date | Number of Pages |
| BSI | 2005 | 24 |
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 7 | Scope Test apparatus Solder bath Dipping device Optical equipment Steam ageing equipment |
| 8 | Lighting equipment Materials Flux Solder Tin-lead |
| 9 | Lead-free SMD reflow equipment Stencil or screen Rubber squeegee or metal spatula Test substrate Solder paste Pb-containing paste |
| 10 | Pb-free paste Reflow equipment Flux removal solvent Procedure Preconditioning Preconditioning by steam ageing |
| 11 | Steam ageing procedure Cleaning of the system Drying and storage procedures Preconditioning by high temperature storage Procedure for dip and look solderability testing |
| 12 | Solder dip conditions Procedure Preparation of terminations Ageing Application of flux Surface mounted devices All other devices |
| 13 | Component termination attitude relative to flux and solder s Solder dip Solder dipping of gold plated terminations Solder bath contaminants control Inspection and failure criteria Inspection magnification Solder coverage |
| 14 | Pinholes, voids, porosity, nonwetting, or dewetting Definition of the areas to be inspected |
| 18 | Procedure for simulated board mounting reflow solderability |
| 19 | Test equipment set-up |
| 20 | Specimen preparation and surface condition |
| 21 | Visual inspection Visual magnification criteria Accept/reject criteria Summary |
