BS EN 60749-29:2011
$142.49
Semiconductor devices. Mechanical and climatic test methods – Latch-up test
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 26 |
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.
This test is classified as destructive.
The purpose of this test is to establish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing “no trouble found” (NTF) and “electrical overstress” (EOS) failures due to latch-up.
This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.
The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 5 | English CONTENTS |
| 6 | 1 Scope and object 2 Terms and definitions |
| 9 | 3 Classification and levels 3.1 Classification 3.2 Levels 4 Apparatus and material 4.1 Latch-up tester |
| 10 | Figures Figure 1 – Vsupply qualification circuit |
| 12 | Figure 3 – Latch-up test flow |
| 13 | Tables Table 1 – Test matrixa |
| 14 | 5.2 Detailed latch-up test procedure Table 2 – Timing specifications for I-test and Vsupply overvoltage test |
| 21 | 6 Failure criteria 7 Summary |
| 22 | Annex A (informative) Examples of special pins that are connectedto passive components |
| 23 | Figure A.1 – Examples of special pins that are connected to passive components |
| 24 | Annex B (informative) Calculation of operating ambient or operating case temperature for a given operating junction temperature |
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BS EN 60749-29:2011
Semiconductor devices. Mechanical and climatic test methods – Latch-up test Published By Publication Date Number…
