BS EN 60749-42:2014
$86.31
Semiconductor devices. Mechanical and climatic test methods – Temperature and humidity storage
| Published By | Publication Date | Number of Pages |
| BSI | 2014 | 12 |
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments.
This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative references 3 Test equipment 3.1 Capacity of the equipment 3.2 Materials and construction of the thermostatic/humidistatic chamber 3.3 Water to be used in the test 4 Procedure 4.1 Preconditioning |
| 8 | 4.2 Initial measurements 4.3 Tests 4.3.1 Inserting and removing specimens 4.3.2 Test conditions 4.3.3 Test duration Table 1 – Temperature and humidity storage test conditions |
| 9 | 4.3.4 Post treatment 4.3.5 End-point measurement 5 Failure criteria Figure 1 – Unsaturated pressurized vapour test conditions profile |
| 10 | 6 Information to be given in applicable procurement document |
