BS EN 61169-48:2015
$142.49
Radio-frequency connectors – Sectional specification for series BMP R.F. coaxial connectors
| Published By | Publication Date | Number of Pages |
| BSI | 2015 | 32 |
IEC 61169-48:2014, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series BMP RF coaxial connectors with blind mating, typically for use in 50 Ohms board to board connection. They may also be used with RF cables or micro-strips in microwave, telecommunication, wireless and other fields. Their operating frequency limit is up to 6 GHz. It describes the interface dimensions with gauging information, electrical and mechanical performance including the mandatory tests selected from IEC 61169-1:2013 applicable to all DS relating to type BMP connectors. This specification indicates the recommended performance characteristics to be considered when writing a DS and covers test schedules and inspection requirements.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | Foreword Endorsement notice |
| 5 | Annex ZA (normative) Normative references to international publications with their corresponding European publications |
| 6 | English CONTENTS |
| 8 | 1 Scope 2 Normative references 3 Mating face and gauge information 3.1 Dimensions – General connectors – Grade 2 3.1.1 Connector with pin-centre contact – Full detent and smooth bore |
| 9 | 3.1.2 Connector with socket-centre contact Figures Figure 1 – Connector with pin-centre contact Tables Table 1 – Dimensions of connector with pin-centre contact |
| 10 | 3.2 Gauges 3.2.1 Gauge pin for socket-centre contact Figure 2 – Connector with socket-centre contact Table 2 – Dimensions of connector with socket-centre contact |
| 11 | 3.2.2 Test procedure Figure 3 – Gauge pin for socket-centre contact Table 3 – Dimensions of gauge pin for socket-centre contact |
| 12 | 3.2.3 Gauge for outer contact of connector with pin-centre contact Figure 4 – Gauge A for sizing test Table 4 – Gauge A for sizing test |
| 13 | Figure 5 – Gauge B for retention test for pin connectors – Full detent Table 5 – Gauge B for retention test for pin connectors – Full detent |
| 14 | 3.3 Dimensions – Standard test connectors – Grade 0 3.3.1 Connector with pin-centre contact Figure 6 – Gauge C for retention test for pin connectors – Smooth bore Table 6 – Gauge C for retention test for pin connectors – Smooth bore |
| 15 | 3.3.2 Connector with socket-centre contact Figure 7 – Connector with pin-centre contact Table 7 – Dimensions of connector with pin-centre contact |
| 16 | 3.4 General requirements for connector mounting on PCB 3.4.1 General Figure 8 – Connector with socket-centre contact Table 8 – Dimensions of connector with socket-centre contact |
| 17 | 3.4.2 Maximum permitting deflexion 3.4.3 Maximum permitting axial clearance 4 Quality assessment procedure 4.1 General 4.2 Rating and characteristics (see Clause 5 of IEC 61169-1:2013) Figure 9 – General requirements for connector mounting on PCB |
| 18 | Table 9 – Preferred climatic categories (see IEC 60068-1) Table 10 – Rating and characteristics |
| 20 | 4.3 Test schedule and inspection requirements – Acceptance tests 4.3.1 Acceptance tests |
| 21 | 4.3.2 Periodic tests Table 11 – Acceptance tests Table 12 – Periodic tests |
| 22 | 4.4 Procedures for the quality conformance 4.4.1 Quality conformance inspection 4.4.2 Quality conformance and its maintenance – General procedure 5 Instructions for preparation of detail specifications 5.1 General |
| 23 | 5.2 Identification of the component 5.3 Performance 5.4 Marking, ordering information and related matters 5.5 Selection of tests, test conditions and severities |
| 24 | 5.6 Blank detail specification pro-forma for type BMP connector |
| 29 | 6 Marking 6.1 Marking of component 6.2 Marking and contents of package |
