BS EN IEC 60747-16-6:2019
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Semiconductor devices – Microwave integrated circuits. Frequency multipliers
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 32 |
IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 7 | English CONTENTS |
| 9 | FOREWORD |
| 11 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 Essential ratings and characteristics 4.1 General requirements 4.1.1 Circuit identification and types 4.1.2 General function description 4.1.3 Manufacturing technology 4.1.4 Package identification 4.2 Application description 4.2.1 Conformance to system and/or interface information 4.2.2 Overall block diagram 4.2.3 Reference data 4.2.4 Electrical compatibility |
| 14 | 4.2.5 Associated devices 4.3 Specification of the function 4.3.1 Detailed block diagram – Functional blocks 4.3.2 Identification and function of terminals |
| 15 | 4.3.3 Function description 4.4 Limiting values (absolute maximum rating system) 4.4.1 Requirements 4.4.2 Electrical limiting values |
| 16 | 4.4.3 Temperatures 4.5 Operating conditions (within the specified operating temperature range) |
| 17 | 4.6 Electrical characteristics 4.7 Mechanical and environmental ratings, characteristics and data 4.8 Additional information |
| 18 | 5 Measuring methods 5.1 General 5.1.1 General precautions 5.1.2 Characteristic impedance 5.1.3 Handling precautions 5.1.4 Types 5.2 Output power (Po) 5.2.1 Purpose 5.2.2 Circuit diagram 5.2.3 Principle of measurement Figures Figure 1 – Circuit diagram for the measurement of the output power |
| 19 | 5.2.4 Circuit description and requirements 5.2.5 Precautions to be observed 5.2.6 Measurement procedure 5.2.7 Specified conditions 5.3 Conversion gain (Gc) 5.3.1 Purpose |
| 20 | 5.3.2 Circuit diagram 5.3.3 Principle of measurement 5.3.4 Circuit description and requirements 5.3.5 Precautions to be observed 5.3.6 Measurement procedure 5.3.7 Specified conditions 5.4 Input return loss (Lret(in)) 5.4.1 Purpose 5.4.2 Circuit diagram |
| 21 | 5.4.3 Principle of measurement 5.4.4 Circuit description and requirements 5.4.5 Precautions to be observed 5.4.6 Measurement procedure Figure 2 – Circuit diagram for the measurement of the input return loss |
| 22 | 5.4.7 Specified conditions 5.5 Output return loss (Lret(out)) 5.5.1 Purpose 5.5.2 Circuit diagram 5.5.3 Principle of measurement Figure 3 – Circuit diagram for the measurement of the output return loss |
| 23 | 5.5.4 Circuit description and requirements 5.5.5 Precautions to be observed 5.5.6 Measurement procedure 5.5.7 Specified conditions |
| 24 | 5.6 Fundamental isolation (Po/P1) 5.6.1 Purpose 5.6.2 Circuit diagram 5.6.3 Principle of measurement 5.6.4 Circuit description and requirements 5.6.5 Precautions to be observed 5.6.6 Measurement procedure |
| 25 | 5.6.7 Specified conditions 5.7 n-th order harmonic isolation (Po/Pnth) 5.7.1 Purpose 5.7.2 Circuit diagram 5.7.3 Principle of measurement 5.7.4 Circuit description and requirements 5.7.5 Precautions to be observed 5.7.6 Measurement procedure |
| 26 | 5.7.7 Specified conditions 5.8 Phase noise (L (f)) 5.8.1 Purpose 5.8.2 Measuring methods Table 1 – Comparison of phase noise measuring methods |
| 27 | Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 1) |
| 28 | Figure 5 – Circuit diagram for the measurement of the phase noise L (f) (method 2) |
| 29 | Figure 6 – Circuit diagram for the measurement of the phase noise L (f) (method 3) |
