🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BS EN IEC 60749-37:2022 – TC

BS EN IEC 60749-37:2022 – TC

$186.33

Tracked Changes. Semiconductor devices. Mechanical and climatic test methods – Board level drop test method using an accelerometer

Published By Publication Date Number of Pages
BSI 2022 60
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: – correction of a previous technical error concerning test conditions; – updates to reflect improvements in technology.

PDF Catalog

PDF Pages PDF Title
1 30467233
33 A-30425837
34 undefined
39 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
40 Blank Page
41 English
CONTENTS
42 FOREWORD
44 INTRODUCTION
45 1 Scope
2 Normative references
3 Terms and definitions
46 4 Test apparatus and components
4.1 Test apparatus
47 4.2 Test components
4.3 Test board
4.4 Test board assembly
48 4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
Table 1 – Quantity of test boards and components required for testing
49 Figure 1 – Drop test apparatus detail
50 5.2 Pre-test characterization
Figure 2 – Calculation of velocity change
51 5.3 Drop testing
Figure 3 – Typical shock test half-sine pulse graphic and formulae
52 6 Failure criteria and failure analysis
53 7 Summary
54 Annex A (informative) Preferred board construction, material, design and layout
A.1 Preferred board construction, material and design
Table A.1 – Test board stack-up and material
55 Table A.2 – Mechanical property requirements for dielectric materials
56 A.2 Preferred test board size, layout, and component locations
Table A.3 – Recommended test board pad sizes and solder mask openings
57 Figure A.1 – Board footprint and BGA layout
58 Figure A.2 – Test vehicle with 4 component placement (top side – left) and 1 component at center location (bottom side – right).
59 Bibliography

Related products

BS EN IEC 60749-37:2022 - TC
$186.33