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BS EN IEC 61760-2:2021 – TC

BS EN IEC 61760-2:2021 – TC

$134.27

Tracked Changes. Surface mounting technology – Transportation and storage conditions of surface mounting devices (SMD). Application guide

Published By Publication Date Number of Pages
BSI 2021 48
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This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and “popcorning”.

PDF Catalog

PDF Pages PDF Title
28 undefined
31 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
33 English
CONTENTS
34 FOREWORD
36 1 Scope
2 Normative references
3 Terms and definitions
4 General conditions
37 5 Transportation conditions
5.1 General transportation conditions
5.2 Special transportation conditions
5.2.1 General
5.2.2 Category 1 (advised for all products)
38 5.2.3 Category 2
6 Storage conditions
39 7 Related issues
40 Annex A (informative)Transportation and storage conditions
41 Table A.1 – Classification of climatic conditions according to IEC 60721-3-2:2018, Table 1
42 Table A.2 – Classification of mechanical conditions according to IEC 60721-3-2:2018, Table 5
43 Figure A.1 – Consolidation of mechanical conditions
44 Table A.3 – Storage conditions according to IEC 60721-3-1:2018, Table 1
45 Annex X (informative) Cross-references for references to the previous edition of this document
Table X.1 – Cross-references
46 Bibliography

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BS EN IEC 61760-2:2021 - TC
$134.27