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BS EN IEC 61967-4:2021

BS EN IEC 61967-4:2021

$189.07

Integrated circuits. Measurement of electromagnetic emissions – Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method

Published By Publication Date Number of Pages
BSI 2021 50
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IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 ? resistive probe and RF voltage measurement using a 150 ? coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition: – frequency range of 150 kHz to 1 GHz has been deleted from the title; – recommended frequency range for 1 ? method has been reduced to 30 MHz; – Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
10 FOREWORD
12 1 Scope
2 Normative references
3 Terms and definitions
4 General
4.1 Measurement basics
13 Figures
Figure 1 – Example of two emitting loops returning to the IC via common ground
Figure 2 – Example of IC with two ground pins, a small I/O loop and two emitting loops
14 4.2 RF current measurement
4.3 RF voltage measurement at IC pins
4.4 Assessment of the measurement technique
5 Test conditions
15 6 Test equipment
6.1 RF measuring instrument
6.2 RF current probe specification
Figure 3 – Construction of the 1 Ω RF current probe
16 6.3 Test of the RF current probe capability
6.4 Matching network specification
Tables
Table 1 – Specification of the RF current probe
17 7 Test setup
7.1 General test configuration
7.2 Printed circuit test board layout
Figure 4 – Impedance matching network corresponding with IEC 61000-4-6
Figure 5 – General test configuration
Table 2 – Characteristics of the impedance matching network
18 8 Test procedure
9 Test report
19 Annexes
Annex A (informative) Probe verification procedure
Figure A.1 – Test circuit
Figure A.2 – Insertion loss of the 1 Ω probe
20 Figure A.3 – Layout of the verification test circuit
21 Figure A.4 – Connection of the verification test circuit
Figure A.5 – Minimum decoupling limit versus frequency
22 Figure A.6 – Example of 1 Ω probe input impedance characteristic
23 Annex B (informative) Classification of conducted emission levels
B.1 Introductory remark
B.2 General
B.3 Definition of emission levels
B.4 Presentation of results
B.4.1 General
24 Figure B.1 – Emission level scheme
25 B.4.2 Examples
Figure B.2 – Example of the maximum emission level G8f
26 Table B.1 – Emission levels
27 Annex C (informative) Example of reference levels for automotive applications
C.1 Introductory remark
C.2 General
C.3 Reference levels
C.3.1 General
28 C.3.2 Measurements of conducted emissions, 1 Ω method
C.3.3 Measurements of conducted emissions, 150 Ω method
Figure C.1 – 1 Ω method – Examples of reference levels for conducted disturbances from semiconductors (peak detector)
Figure C.2 – 150 Ω method – Examples of reference levels for conducted disturbances from semiconductors (peak detector)
29 Annex D (informative) EMC requirements and how to use EMC IC measurement techniques
D.1 Introductory remark
D.2 Using EMC measurement procedures
D.3 Assessment of the IC influence to the EMC behaviour of the modules
Table D.1 – Examples in which the measurement procedure can be reduced
30 Table D.2 – System- and module-related ambient parameters
Table D.3 – Changes at the IC which influence the EMC
31 Annex E (informative) Example of a test setup consisting of an EMC main test board and an EME IC test board
E.1 Introductory remark
E.2 EMC main test board
32 Figure E.1 – EMC main test board
Figure E.2 – Jumper field
33 E.3 EME IC test board
E.3.1 General explanation of the test board
E.3.2 How to build the test system
Figure E.3 – EME IC test board (contact areas for the spring connector pins of the main test board)
34 Figure E.4 – Example of an EME IC test system
35 E.3.3 PCB layout and component positioning
Figure E.5 – Component side of the EME IC test board
36 Figure E.6 – Bottom side of the EME IC test board
37 Annex F (informative) 150 Ω direct coupling networks for common mode emission measurements of differential mode data transfer ICs and similar circuits
F.1 Basic direct coupling network
Figure F.1 – Basic direct coupling for common mode EMC measurements
38 F.2 Example of a common-mode coupling network alternative for LVDS or RS485 or similar systems
Figure F.2 – Measurement setup for the S21 measurement of the common-mode coupling
Figure F.3 – Using split load termination as coupling for measuring equipment
39 F.3 Example of a common-mode coupling network alternative for differential IC outputs to resistive loads (e.g. airbag ignition driver)
F.4 Example of a common-mode coupling network for CAN systems
Figure F.4 – Using split load termination as coupling for measuring equipment
Figure F.5 – Example of an acceptable adaptation for special network requirements (e.g. for CAN systems)
40 Annex G (informative) Measurement of conducted emissions in extended frequency range
G.1 General
G.2 Guidelines
G.2.1 Measurement network
41 G.2.2 Network components
Figure G.1 – Example of a 150 Ω measurement network
42 Figure G.2 – Example of RF characteristic of network components
43 G.2.3 Network layout
G.2.4 Network verification
44 G.2.5 Test board
Figure G.3 – Examples of S21 characteristic by simulation
45 Figure G.4 – Examples of test board section
Figure G.5 – Examples of unwanted cross coupling between measurement network and traces on test PCB
Figure G.6 – Examples of unwanted signal line cross coupling on S21 transfer characteristic of RF measurement network
46 G.3 Application area
Figure G.7 – Examples of test board with additional signal line connected to IC pin
Figure G.8 – Examples of stub lines length effects on S21 transfer characteristic of RF measurement network
47 Table G.1 – Draft selection table for conducted emission measurements at pins above 1 GHz
48 Bibliography

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