BS EN IEC 62435-9:2021
$102.76
Electronic components. Long-term storage of electronic semiconductor devices – Special cases
Published By | Publication Date | Number of Pages |
BSI | 2021 | 22 |
This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor device building blocks of all types that are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity.
NOTE In IEC 62435 (all parts), the term “components” is used interchangeably with dice, wafers, passives and packaged devices.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
8 | FOREWORD |
10 | INTRODUCTION |
12 | 1 Scope 2 Normative references 3 Terms and definitions |
14 | 4 Component storage cases 5 Storage of memory devices 5.1 General 5.2 Semiconductor memory device types |
15 | Table 1 ā Example failure mechanisms and stimuli for memory devices |
16 | 6 Storage of other devices and partial assembly 6.1 General 6.2 Wafer-level chip-scale packages |
17 | 6.3 Heterogeneous devices 6.4 Modules 7 Storage in alternative environments 7.1 General 7.2 Alternative environments |
18 | 7.3 Storage environment effect on use reliability |
19 | Annex A (informative)Customer-supplier interaction Table A.1 ā Supplier ā customer interaction template |
20 | Bibliography |