BS IEC 61000-4-36:2014
$215.11
Electromagnetic compatibility (EMC) – Testing and measurement techniques. IEMI immunity test methods for equipment and systems
| Published By | Publication Date | Number of Pages |
| BSI | 2014 | 88 |
This part of IEC 61000 provides methods to determine test levels for the assessment of the immunity of equipment and systems to intentional electromagnetic interference (IEMI) sources. It introduces the general IEMI problem, IEMI source parameters, derivation of test limits and summarises practical test methods.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and defintions |
| 14 | 3.2 Abbreviations |
| 15 | 4 General 5 IEMI environments and interaction 5.1 General |
| 16 | 5.2 IEMI environments 5.2.1 Technical capability groups 5.2.2 IEMI deployment scenarios |
| 17 | 5.2.3 Radiated IEMI environment summary 5.2.4 Published conducted IEMI environments Tables Table 1 โ Possible IEMI Deployment Scenarios Table 2 โ Summary of radiated IEMI source output (rEfar) by capability group |
| 18 | 5.3 Interaction with fixed installations 5.3.1 General Figures Figure 1 โ Example of radiated and conducted IEMI interaction with a building |
| 19 | 5.3.2 Protection level 6 Test methods 6.1 Derivation of applicable test methods Table 3 โ Example protection levels |
| 20 | 6.2 Derivation of transfer functions Figure 2 โ Assessment options |
| 21 | 6.3 Radiated tests using IEMI simulator 6.4 Radiated tests using a reverberation chamber 6.5 Complex waveform injection (CWI) 6.6 Damped sinusoidal injection (DSI) 6.7 Electrostatic discharge (ESD) 6.8 Electrically fast transient (EFT) |
| 22 | 6.9 Antenna port injection 7 Test parameters 7.1 Derivation of immunity test parameters Figure 3 โ Examples of ports |
| 23 | 7.2 Radiated test parameters 7.2.1 Generic hyperband test parameters (skilled capability group) 7.2.2 Generic mesoband test parameters (skilled capability group) Figure 4 โ Typical hyperband waveform Table 4 โ Generic hyperband test parameters (skilled capability group) |
| 24 | Table 5 โ Generic mesoband test parameters (skilled capability group) |
| 25 | 7.2.3 Generic hypoband/narrowband test parameters (skilled capability group) Figure 5 โ Typical mesoband waveform Table 6 โ Generic hypoband/narrowband test parameters (skilled capability group) |
| 26 | 7.3 Generic conducted IEMI test parameters 7.3.1 General Figure 6 โ Typical hypoband/narrowband waveform Table 7 โ Conducted IEMI test levels |
| 27 | 7.3.2 Characteristics and performance of the fast damped oscillatory wave generator Figure 7 โ Waveform of the damped oscillatory wave (open circuit voltage) Table 8 โ Open circuit specifications |
| 28 | 7.4 Tailored test level derivation 7.5 Relevance of EMC immunity data Table 9 โ Short Circuit Specifications |
| 29 | 8 Bibliography |
| 31 | Annex A (informative) Failure mechanisms and performance criteria A.1 General A.2 Failure mechanisms A.2.1 General |
| 32 | A.2.2 Noise A.2.3 Parameter offset and drifts Figure A.1 โ IEMI induced offset of sensor output โ Corruption of information |
| 33 | A.2.4 System upset or breakdown A.2.5 Component destruction Figure A.2 โ Collision of an induced disturbance with data bits [1] Figure A.3 โ Examples of destruction on a chip [2] |
| 34 | A.3 Effect of pulse width A.4 Performance criteria Figure A.4 โ Generic failure trend as a function of pulse width |
| 35 | A.5 References Table A.1 โ Recommended performance criteria |
| 37 | Annex B (informative) Developments in IEMI source environments B.1 General Figure B.1 โ A comparison of HPEM and IEMI spectra [6] |
| 38 | B.2 IEMI environment |
| 39 | B.3 IEMI sources Figure B.2 โ Representation of typical IEMI radiation and coupling onto systems [3] |
| 40 | Figure B.3 โ Parameter space in power/frequency occupied by sophisticated IEMI (i.e. DEW) sources [1] Figure B.4 โ Peak power and energy from continuous and pulsed (durations shown) microwave sources, narrowband and wideband |
| 41 | Figure B.5 โ Peak powers of various types of pulsed HPM sources [1] Figure B.6 โ Peak vs. average power for microwave sources with duty factors indicated |
| 42 | Figure B.7 โ Phase coherence leading to a compact HPM source with N2 scaling of output power Figure B.8 โ Briefcase mesoband UWB source sold by Diehl-Rheinmetall [3] |
| 43 | B.4 Published radiated IEMI environments B.4.1 IEC 61000-2-13 B.4.2 Mil-Std-464C Figure B.9 โ A do-it-yourself electromagnetic weapon made from an oven magnetron [13] Table B.1 โ IEMI environments from IECย 61000-2-13 |
| 44 | B.4.3 The International Telecommunication Union (ITU) B.4.4 Practical determination of a tailored test level โ An example Table B.2 โ Hypoband/narrowband HPM environment Table B.3 โ Hyperband/wideband HPM environment |
| 45 | B.5 Summary Figure B.10 โ Plot of entire narrowband system weight as a function of output microwave power for land-mobile and land-transportable systems |
| 46 | B.6 References |
| 48 | Annex C (informative) Interaction with buildings C.1 Building attenuation Figure C.1 โ Typical unprotected low-rise building plane wave E-field attenuation collected from references |
| 49 | C.2 Coupling to cables Table C.1 โ Shielding effectiveness measurements for various power system buildings and rooms |
| 50 | C.3 Low voltage cable attenuation Figure C.2 โ Cable coupling โ Resonance region |
| 51 | C.4 References Figure C.3 โ Mains cable attenuation profile |
| 53 | Annex D (informative) Relation between plane wave immunity testing and immunity testing in a reverberation chamber D.1 General |
| 54 | D.2 Relation between measurements of shielding effectiveness in the two environments |
| 57 | D.3 Relation between immunity testing in the two environments |
| 59 | D.4 Additional aspects D.5 References |
| 62 | Annex E (informative) Complex waveform injection โ Test method E.1 General E.2 Prediction E.2.1 General |
| 63 | Figure E.1 โ LLSC reference field measurement set-up |
| 64 | Figure E.2 โ LLSC induced current measurement set-up Figure E.3 โ Typical LLSC magnitude-only transfer function |
| 65 | Figure E.4 โ Prediction of induced current using minimum phase constraints |
| 66 | E.2.2 Example Figure E.5 โ IECย 61000-2-9 early-time (E1) HEMP environment |
| 67 | Figure E.6 โ Overlay of transfer function and threat (frequency domain) Figure E.7 โ Predicted current |
| 68 | E.3 Construction Table E.1 โ Time waveform norms |
| 69 | Figure E.8 โ Example of de-convolution result Figure E.9 โ Damped sinusoidal waveforms โ Ten-component fit |
| 70 | Figure E.10 โ Approximated and predicted transient Figure E.11 โ Approximated and predicted transient (0 ns to 100 ns) |
| 71 | Figure E.12 โ Approximation and prediction transient โ Frequency domain comparison |
| 72 | E.4 Injection Figure E.13 โ Variation in error for increasing number of damped sinusoids |
| 73 | Figure E.14 โ Complex injection set-up Figure E.15 โ Amplifier requirements for various current levels |
| 74 | E.5 Summary E.6 References Figure E.16 โ Comparison of predicted (green) and injected (red) current |
| 76 | Annex F (informative) Significance of test methodology margins F.1 General F.2 Examples F.2.1 General |
| 77 | F.2.2 Negative contributions Figure F.1 โ Variation in induced currents as a result of configuration |
| 78 | Figure F.2 โ Comparison of HPD and VPD induced currents Figure F.3 โ System variability |
| 79 | F.2.3 Positive contributions Figure F.4 โ Comparison of single- and multi-port injection |
| 80 | Figure F.5 โ Example transfer functions and worst-case envelope Figure F.6 โ Comparison of individual and worst-case transfer function predictions |
| 81 | F.2.4 Summary F.3 References Figure F.7 โ Comparison between predicted and measured induced currents |
| 82 | Annex G (informative) Intentional EMI โ The issue of jammers G.1 General G.2 Effects |
| 83 | G.3 Published accounts of jamming G.4 Risk assessment G.5 Mitigation |
| 84 | G.6 References |
