BS IEC 61000-4-36:2020
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Electromagnetic compatibility (EMC) – Testing and measurement techniques. IEMI immunity test methods for equipment and systems
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 110 |
This part of IEC 61000 provides methods to determine test levels for the assessment of the immunity of equipment and systems to intentional electromagnetic interference (IEMI) sources. It introduces the general IEMI problem, IEMI source parameters, derivation of test limits and summarises practical test methods.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 3 | CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 15 | 3.2 Abbreviated terms |
| 16 | 4 General |
| 17 | 5 IEMI environments and interaction 5.1 General |
| 18 | 5.2 IEMI environments 5.2.1 Technical capability groups 5.2.2 IEMI deployment scenarios 5.2.3 Radiated IEMI environment summary Tables Table 1 โ Possible IEMI deployment scenarios |
| 19 | 5.2.4 Published conducted IEMI environments 5.3 Interaction with victim equipment, systems and installations 5.3.1 General Table 2 โ Summary of high power radiated IEMI source output (rEfar) by capability group |
| 20 | 5.3.2 Protection level Figures Figure 1 โ Example of radiated and conducted IEMI interaction with a building Table 3 โ Examples of protection levels |
| 21 | 6 Test methods 6.1 Derivation of applicable test methods |
| 22 | 6.2 Derivation of transfer functions Figure 2 โ Assessment options |
| 23 | 6.3 Radiated tests using IEMI simulator 6.4 Radiated tests using a reverberation chamber 6.5 Complex waveform injection (CWI) 6.6 Damped sinusoidal injection (DSI) 6.7 Electrostatic discharge (ESD) 6.8 Electrically fast transient (EFT) |
| 24 | 6.9 Antenna port injection 7 Test parameters 7.1 Derivation of immunity test parameters 7.2 Radiated test parameters 7.2.1 Generic hyperband test parameters (skilled capability group) Figure 3 โ Examples of ports |
| 25 | Table 4 โ Generic hyperband test parameters (skilled capability group) Table 5 โ Radiated hyperband test waveform and other pulse parameters |
| 26 | 7.2.2 Generic mesoband test parameters (skilled capability group) Figure 4 โ Example of hyperband waveform Table 6 โ Generic mesoband test parameters (skilled capability group) |
| 27 | Table 7 โ Comparison of quality factor (Q) with bandratio Table 8 โ Radiated mesoband waveform and other pulse parameters |
| 28 | 7.2.3 Generic hypoband test parameters (skilled capability group) Figure 5 โ Example of mesoband waveform Table 9 โ Generic hypoband/narrowband test parameters (skilled capability group) |
| 29 | 7.3 Generic conducted IEMI test parameters 7.3.1 General Figure 6 โ Typical hypoband/narrowband waveform Table 10 โ Conducted IEMI test levels |
| 30 | 7.3.2 Characteristics and performance of the fast damped oscillatory wave generator Figure 7 โ Waveform of the damped oscillatory wave (open circuit voltage) Table 11 โ Open circuit specifications |
| 31 | 7.4 Tailored test level derivation 7.5 Relevance of EMC immunity data Table 12 โ Short circuit specifications |
| 32 | Annexes Annex A (informative) Failure mechanisms and performance criteria A.1 General A.2 Failure mechanisms A.2.1 General |
| 33 | A.2.2 Noise A.2.3 Parameter offset and drifts Figure A.1 โ IEMI induced offset of sensor output โ Corruption of information |
| 34 | A.2.4 System upset or breakdown A.2.5 Component destruction Figure A.2 โ Collision of an induced disturbance with data bits [A.1] Figure A.3 โ Examples of destruction on a chip [A.2] |
| 35 | A.3 Effect of pulse width A.4 Performance criteria Figure A.4 โ Generic failure trend as a function of pulse width |
| 36 | A.5 References Table A.1 โ Recommended performance criteria |
| 38 | Annex B (informative) Developments in IEMI source environments B.1 General Figure B.1 โ A comparison of HPEM and IEMI spectra [B.6] |
| 39 | B.2 IEMI environment |
| 40 | B.3 IEMI sources Figure B.2 โ Representation of typical IEMI radiation and coupling onto systems [B.3] |
| 41 | Figure B.3 โ Parameter space in power/frequency occupied by sophisticated IEMI(i.e. DEW) sources in comparison to common RF systems [B.1] Figure B.4 โ Peak power and energy from continuous and pulsed (durations shown) microwave sources, narrowband and wideband |
| 42 | Figure B.5 โ Peak powers of various types ofpulsed hypoband/narrowband sources [B.1] Figure B.6 โ Peak versus average power for microwavesources with duty factors indicated |
| 43 | Figure B.7 โ Phase coherence leading to a compact HPMsource with N2 scaling of output power Figure B.8 โ Briefcase mesoband DS source sold by Diehl-Rheinmetall [B.3] |
| 44 | B.4 Published radiated IEMI environments B.4.1 IEC 61000-2-13 [B.14] B.4.2 Mil-Std-464C Figure B.9 โ A do-it-yourself electromagnetic weapon made from an oven magnetron [B.13] Table B.1 โ IEMI environments from IEC 61000-2-13 |
| 45 | Table B.2 โ Hypoband/narrowband HPM environment from [B.17] Table B.3 โ Wideband (mesoband/hyperband) HPM environment from [B.17] |
| 46 | B.4.3 Selection of parameters for mesoband immunity test Figure B.10 โ Wideband (mesoband and hyperband) EME derived from [B.17] |
| 48 | B.4.4 International Telecommunication Union (ITU) B.5 Summary |
| 49 | B.6 References Figure B.11 โ Plot of entire narrowband system weight as a function of output microwave power for land-mobile and land-transportable systems |
| 51 | Annex C (informative) Interaction with buildings C.1 Building attenuation Figure C.1 โ Typical unprotected low-rise building plane wave E-field attenuation collected from references |
| 52 | C.2 Coupling to cables Table C.1 โ Shielding effectiveness measurements for various power system buildings and rooms |
| 53 | C.3 Low voltage cable attenuation Figure C.2 โ Cable coupling and resonance region |
| 54 | C.4 References Figure C.3 โ Mains cable attenuation profile |
| 56 | Annex D (informative) Relation between plane wave immunity testing and immunity testing in a reverberation chamber D.1 General |
| 57 | D.2 Relation between measurements of shielding effectiveness in the two environments |
| 60 | D.3 Relation between immunity testing in the two environments |
| 62 | D.4 Additional aspects D.5 References |
| 65 | Annex E (informative) Complex waveform injection โ Test method E.1 General E.2 Prediction E.2.1 General |
| 66 | Figure E.1 โ LLSC reference field measurement set-up |
| 67 | Figure E.2 โ LLSC induced current measurement set-up Figure E.3 โ Typical LLSC magnitude-only transfer function |
| 68 | Figure E.4 โ Prediction of induced current using minimum phase constraints |
| 69 | E.2.2 Example Figure E.5 โ IEC 61000-2-9 early-time (E1) HEMP environment |
| 70 | Figure E.6 โ Overlay of transfer function and threat (frequency domain) Figure E.7 โ Predicted current |
| 71 | E.3 Construction Table E.1 โ Time waveform norms |
| 72 | Figure E.8 โ Example of de-convolution result Figure E.9 โ Damped sinusoidal waveforms โ Ten-component fit |
| 73 | Figure E.10 โ Approximated and predicted transient Figure E.11 โ Approximated and predicted transient (0 ns to 100 ns) |
| 74 | Figure E.12 โ Approximation and prediction transient โ Frequency domain comparison |
| 75 | E.4 Injection Figure E.13 โ Variation in error for an increasing number of damped sinusoids |
| 76 | Figure E.14 โ Complex injection set-up Figure E.15 โ Amplifier requirements for various current levels |
| 77 | E.5 Summary E.6 References Figure E.16 โ Comparison of predicted (green) and injected (red) current |
| 79 | Annex F (informative) Significance of test methodology margins F.1 General F.2 Examples F.2.1 General |
| 80 | F.2.2 Negative contributions Figure F.1 โ Variation in induced currents as a result of configuration |
| 81 | Figure F.2 โ Comparison of HPD and VPD induced currents Figure F.3 โ System variability |
| 82 | F.2.3 Positive contributions Figure F.4 โ Comparison of single- and multi-port injection |
| 83 | Figure F.5 โ Example of transfer functions and worst-case envelope Figure F.6 โ Comparison of individual and worst-case transfer function predictions |
| 84 | F.2.4 Summary F.3 References Figure F.7 โ Comparison between predicted and measured induced currents |
| 85 | Annex G (informative) Intentional EMI โ The issue of jammers G.1 General G.2 Effects |
| 86 | G.3 Published accounts of jamming G.4 Risk assessment G.5 Mitigation |
| 87 | G.6 References |
| 89 | Annex H (normative) Hyperband and mesoband radiated transients immunity test method H.1 Overview H.2 Test equipment H.2.1 General H.2.2 Test facility |
| 90 | H.2.3 Hyperband transient pulse radiating test system H.2.4 Mesoband transient pulse radiating test system H.2.5 Measurement chain Figure H.1 โ Measurement chain for field uniformityassessment and transient responses |
| 91 | H.3 Field uniformity assessment H.3.1 Field uniformity assessment in an anechoic chamber |
| 92 | Figure H.2 โ Test set-up for field uniformity assessment in anechoic chamber |
| 94 | H.3.2 Field uniformity in GTEM waveguide H.4 Test set-up H.4.1 General |
| 95 | Figure H.3 โ Example of test set-up for table-top equipment/system Figure H.4 โ Example of test set-up for floor-standing equipment/system |
| 96 | H.4.2 Arrangement of table-top equipment H.4.3 Arrangement of floor-standing equipment H.4.4 Arrangement of wiring Figure H.5 โ Example of test set-up in GTEM waveguide |
| 97 | H.5 Test procedure H.5.1 General H.5.2 Laboratory reference conditions H.5.3 Execution of the test |
| 99 | H.5.4 Evaluation of test results H.6 Test report |
| 100 | H.7 References |
| 101 | Annex I (informative) Calibration method and measurement uncertainty of sensors for the measurement of radiated hyperband and mesoband transient fields I.1 General I.2 Calibration method in TEM waveguides in IEC 61000-4-20:2010, Annex E [I.1] I.2.1 General |
| 102 | I.2.2 Probe calibration requirements |
| 103 | I.2.3 Field probe calibration procedure in case of a one-port TEM waveguide Figure I.1 โ Example of the measurement points for the validation Table I.1 โ Calibration frequencies |
| 104 | I.3 Calibration procedures for D-dot sensors in the time domain I.3.1 General Figure I.2 โ Set-up for calibration of E-field probe in one-port TEM waveguide |
| 105 | Figure I.3 โ Cone and ground plane sensor calibration set-up |
| 106 | I.4 Measurement uncertainty Table I.2 โ Type B expanded uncertainties for sensor calibrations in GTEM cell field generation system |
| 107 | I.5 References Table I.3 โ Type B expanded uncertainties for sensor calibrations in the cone and ground plane cell field generation system |
| 108 | Bibliography |
