BS IEC 63275-1:2022
$102.76
Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors – Test method for bias temperature instability
Published By | Publication Date | Number of Pages |
BSI | 2022 | 16 |
PDF Catalog
PDF Pages | PDF Title |
---|---|
2 | undefined |
4 | English CONTENTS |
5 | FOREWORD |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms and definitions 4 Requirements 4.1 Sample 4.2 Test temperature 4.3 Test voltage |
9 | 4.4 Test time 4.5 Measurement temperature 4.6 Failure criteria 4.7 Test circuit 5 Procedures 5.1 Sequence of procedure Figures Figure 1 – Circuit diagram for bias temperature instability test |
10 | 5.2 Select sample 5.3 VGS(th) measurement methods Figure 2 – Test flow chart |
11 | Figure 3 – Schematic of test pattern for Example 1 Figure 4 – IDS versus VGS curve for Example 1 |
12 | Figure 5 – Schematic of test pattern for Example 2 and Example 3 Figure 6 – IDS versus VGS curve for Example 2 Figure 7 – IDS – VGS curve for Example 3 |
13 | 5.4 How to provide a reproducible measurement of VGS(th) 5.5 Initial measurement Figure 8 – Schematic of test pattern for Example 4 |
14 | 5.6 Apply voltage and temperature stress 5.7 Remove voltage and temperature stress 5.8 Intermediate measurement 6 Test report |
15 | Bibliography |