BS ISO 21859:2019
$86.31
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 12 |
This document specifies a test method for plasma resistance of ceramic components in semiconductor manufacturing equipment. It is applicable to ceramic components of plasma-resistant components in dry etching chambers used in semiconductor manufacturing.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 6 | Foreword |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions 4 Principle of measurement |
| 8 | 5 Test environment 6 Apparatus 6.1 Plasma-etching equipment 6.2 Contact-probe profilometer 6.3 Surface roughness profilometer 7 Test pieces 7.1 General consideration 7.2 Surface conditions 8 Procedure 8.1 Measurement of surface roughness before a plasma resistance test |
| 9 | 8.2 Masking 8.3 Plasma resistance test 8.3.1 Setting of test pieces 8.3.2 Test conditions 8.4 Measurement of erosion depth 8.5 Measurement of surface roughness after the plasma resistance test 9 Calculation 9.1 Calculation of mean erosion depth |
| 10 | 9.2 Calculation of surface roughness 10 Test report |
