BSI 19/30364443 DC:2019 Edition
$13.70
BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices – Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 19 |
| Status | Definitive |
|---|---|
| Pages | 19 |
| Publication Date | 2019-01-04 |
| Standard Number | 19/30364443 DC |
| Title | BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices – Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices |
| Identical National Standard Of | IEC 62047-35 Ed.1.0, FprEN IEC 62047-35:2019 |
| Descriptors | Semiconductor technology, Electromechanical devices, Deformation, Test methods, Semiconductor devices |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.080.99 - Other semiconductor devices |
