BSI 19/30396945 DC:2019 Edition
$13.70
BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
Published By | Publication Date | Number of Pages |
BSI | 2019 | 17 |
Status | Definitive |
---|---|
Pages | 17 |
Publication Date | 2019-11-29 |
Standard Number | 19/30396945 DC |
Title | BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress |
Identical National Standard Of | IEC 63251 Ed.1.0 |
Descriptors | Test methods, Printed-circuit boards, Stress, Thermal stress, Reliability, Assessed reliability |
Publisher | BSI |
Committee | EPL/501 |
ICS Codes | 31.180 - Printed circuits and boards |