BSI 20/30404083 DC 2020
$13.70
BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices – Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 13 |
| Status | Definitive |
|---|---|
| Pages | 13 |
| Publication Date | 2020-02-07 |
| Standard Number | 20/30404083 DC |
| Title | BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices – Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection |
| Identical National Standard Of | IEC 62047-38 Ed.1.0 |
| Descriptors | Semiconductor devices, Vocabulary, Electronic equipment and components, Semiconductor technology, Integrated circuits, Terminology, Electromechanical devices |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.140 - Piezoelectric devices |
