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BSI 23/30469010 DC:2023 Edition

BSI 23/30469010 DC:2023 Edition

$13.70

BS EN IEC 63378-3. Thermal standardization on semiconductor packages – Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Published By Publication Date Number of Pages
BSI 2023 16
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PDF Catalog

PDF Pages PDF Title
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms and definitions
3.4
8 4 Procedure of thermal circuit network model
4.1 General
4.2 Detailed model analysis
11 4.3 Delphi model preparation
4.4 Thermal circuit model topology
12 4.5 Determination of thermal capacitance values
14 Annex A (normative) Validation for TO-252 case
A.1 General
A.2 Simulation parameters
A.3 Comparison detailed thermal model vs D2elphi model
16 Bibliography

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BSI 23/30469010 DC
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