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BSI PD IEC TR 62878-2-7:2019

BSI PD IEC TR 62878-2-7:2019

$102.76

Device embedding assembly technology – Guidelines. Accelerated stress testing of passive embedded circuit boards

Published By Publication Date Number of Pages
BSI 2019 16
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This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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BSI PD IEC TR 62878-2-7:2019
$102.76