BSI PD IEC/TS 62647-23:2013
$189.07
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
| Published By | Publication Date | Number of Pages |
| BSI | 2013 | 49 |
This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow therepair technician to execute the task.
This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “rework/repair” is used as defined in 3.1.29 and 3.1.30.
The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
NOTE 1 For the purposes of this document, if the element “lead” is implied, it will be stated either as Pb, as lead (Pb), or as tin-lead. If a piece part terminal or termination “lead” is referred to, such as in a flat pack or a dualinline package, the nomenclature lead/terminal or lead-terminal will be used.
NOTE 2 Processes identified in the document apply to either rework or repair. This document may be used by other high-performance and high-reliability industries, at their discretion.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 10 | 1 Scope 2 Normative references |
| 11 | 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 16 | 3.2 Abbreviations |
| 18 | 4 Pb-free concerns 4.1 General 4.2 Reliability 4.2.1 General 4.2.2 Mixed metallurgy reliability |
| 19 | 4.3 Configuration management |
| 20 | 4.4 Risk management 4.5 Tin whiskers 4.6 Copper dissolution (erosion) 5 Materials 5.1 Solder 5.1.1 General 5.1.2 Solder alloys |
| 21 | 5.1.3 Solder forms |
| 22 | 5.2 Fluxes 5.3 Piece parts 5.3.1 General 5.3.2 Termination finishes 5.3.3 Area arrays (BGA, CSP, etc.) |
| 23 | 5.4 Printed circuit boards/printed wiring boards 5.4.1 Laminate material 5.4.2 Surface finish 5.5 Conformal coatings |
| 24 | 6 Soldering equipment 6.1 General 6.2 Hand soldering equipment 6.2.1 General hand soldering equipment considerations 6.2.2 Tip selection |
| 25 | 6.2.3 Soldering iron tip life Figures Figure 1 – Soldering iron tip construction Figure 2 – Worn soldering iron tip |
| 26 | 6.3 Fountain soldering Figure 3 – Copper dissolution |
| 27 | 6.4 Convective soldering equipment 6.4.1 General 6.4.2 Thermal profile issues |
| 28 | 7 General rework/repair considerations 7.1 General 7.2 Rework/repair procedure order of precedence |
| 29 | 7.3 Technician training 7.4 Pb-free rework/repair considerations 7.4.1 General 7.4.2 General process considerations |
| 30 | 7.4.3 Solder processing considerations 7.4.4 Flux considerations |
| 31 | 8 Pre-rework/repair processes 8.1 Alloy identification 8.1.1 IPC/JEDEC J-STD-609A |
| 32 | Tables Table 1 – Assembly and piece part marking methods |
| 33 | 8.1.2 X-ray fluorescence (XRF) 8.1.3 Pb swabs 8.2 Piece part and CCA preparation 8.2.1 General 8.2.2 Piece part preparation |
| 34 | 8.2.3 CCA preparation 9 Rework/repair processes 9.1 General 9.2 Conductive hand soldering |
| 36 | 9.3 Convective soldering process 9.3.1 General 9.3.2 Solder paste handling 9.3.3 Paste printing 9.3.4 Reflow process |
| 38 | 10 Post-rework/repair processes 10.1 Cleaning 10.2 Inspection 10.3 Reapplication of conformal coating |
| 39 | Annex A (informative) Termination finishes Table A.1 – Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC/TS 62647-22:2013) |
| 40 | Table A.2 – BGA piece parts risk |
| 41 | Annex B (informative) Tin whiskers |
| 43 | Table B.1 – Tin whisker information (see IEC/TS 62647-22:2013) |
| 44 | Table B.2 – Piece part termination tin whisker risks(see IEC/TS 62647-22:2013) |
| 46 | Bibliography |
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BSI PD IEC/TS 62647-23:2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and…
