BSI PD IEC TS 62915:2023:2024 Edition
$189.07
Photovoltaic (PV) modules. Type approval, design and safety qualification. Retesting
| Published By | Publication Date | Number of Pages |
| BSI | 2024 | 48 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 6 | FOREWORD |
| 9 | 1 Scope 2 Normative references |
| 10 | 3 Terms and definitions |
| 11 | 4 Retesting 4.1 General |
| 12 | 4.2 Test programs for WBT PV modules (including crystalline silicon) 4.2.1 Modification to frontsheet |
| 14 | 4.2.2 Modification to encapsulation system |
| 16 | 4.2.3 Modification to cell technology (specific to wafer-based technologies (WBT)) |
| 17 | 4.2.4 Modification to cell and string interconnect material (specific to WBT) |
| 18 | 4.2.5 Modification to backsheet |
| 20 | 4.2.6 Modification to electrical termination |
| 22 | 4.2.7 Modification to bypass diode 4.2.8 Modification to electrical circuitry (specific to WBT) |
| 23 | 4.2.9 Modification to edge sealing |
| 24 | 4.2.10 Modification to frame and/or mounting structure Figure 1 – X-X and Y-Y axes relevant for the elastic section modulus of a typical PV frame |
| 26 | 4.2.11 Change in PV module size 4.2.12 Higher or lower output power with the identical design and size |
| 27 | 4.2.13 Increase of over-current protection rating 4.2.14 Increase of system voltage by more than 5 % |
| 28 | 4.2.15 Change in cell fixing or internal insulation tape (specific to WBT) 4.2.16 Change in label material (external nameplate label) 4.2.17 Change from monofacial to bifacial module |
| 29 | 4.2.18 Changes to module operating temperature 4.2.19 Changes affecting system compatibility with variants of the same model 4.3 Test programs for MLI thin-film PV modules |
| 30 | 4.3.1 Modification to frontsheet 4.3.2 Modification to encapsulation system 4.3.3 Modification to front contact (e. g. TCO) 4.3.4 Modification to cell technology |
| 31 | 4.3.5 Modification to cell layout 4.3.6 Modification to back contact |
| 32 | 4.3.7 Modification to edge deletion 4.3.8 Modification to interconnect material or technique |
| 33 | 4.3.9 Modification to backsheet 4.3.10 Modification to electrical termination 4.3.11 Modification to bypass diode 4.3.12 Modification to edge sealing 4.3.13 Modification to frame and/or mounting structure 4.3.14 Change in PV module size |
| 34 | 4.3.15 Higher or lower output power with the identical design and size 4.3.16 Increase of over-current protection rating 4.3.17 Increase of system voltage 4.3.18 Change in label material (external nameplate label) 4.3.19 Change from monofacial to bifacial module 4.3.20 Changes to module operating temperature 4.3.21 Changes affecting compatibility with variants of the same model 4.3.22 Changes to documentation |
| 35 | Annex A (normative)Retests and test flow A.1 Required retests for PV modules, tabular overview Table A.1 – Required retests for PV modules |
| 42 | A.2 Combined test flow IEC 61215 and IEC 61730 (see Figure A.1 and Table A.2) Figure A.1 – Combined test flow IEC 61215 and IEC 61730 |
| 43 | Table A.2 – IEC identifiers for test sequences |
| 44 | A.3 Tests for new combinations of materials and/or components |
| 45 | Figure A.2 – Illustration of example for required tests for new material combinations |
| 46 | Bibliography |
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