{"id":371694,"date":"2024-10-20T02:25:54","date_gmt":"2024-10-20T02:25:54","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61215-22021\/"},"modified":"2024-10-26T04:13:40","modified_gmt":"2024-10-26T04:13:40","slug":"bs-en-iec-61215-22021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61215-22021\/","title":{"rendered":"BS EN IEC 61215-2:2021"},"content":{"rendered":"

IEC 61215-2:2021 is available as IEC 61215-2:2021 RLV<\/span> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 61215-2:2021 lays down requirements for the design qualification of terrestrial photovoltaic modules suitable for long-term operation in open-air climates. This document is intended to apply to all terrestrial flat plate module materials such as crystalline silicon module types as well as thin-film modules. The objective of this test sequence is to determine the electrical characteristics of the module and to show, as far as possible within reasonable constraints of cost and time, that the module is capable of withstanding prolonged exposure outdoors. This second edition of IEC 61215-2 cancels and replaces the first edition of IEC 61215-2 issued in 2016. This edition includes the following significant technical changes with respect to the previous edition: a. Addition of cyclic (dynamic) mechanical load testing (MQT 20). b. Addition of a test for detection of potential-induced degradation (MQT 21). c. Addition of test methods required for bifacial PV modules. d. Addition of test methods required for flexible modules. This includes the addition of the bending test (MQT 22). e. Revision of simulator requirements to ensure uncertainty is both well-defined and minimized. f. Correction to the hot spot endurance test, where the procedure for monolithically integrated (MLI) thin film technologies (MQT 09.2) previously included two sections describing a procedure only appropriate for silicon modules. g. Selection of three diodes, rather than all, for testing in the bypass diode thermal test (MQT 18). h. Removal of the nominal module operating test (NMOT), and associated test of performance at NMOT, from the IEC 61215 series.<\/p>\n

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2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
11<\/td>\nFOREWORD <\/td>\n<\/tr>\n
13<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
14<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
16<\/td>\n3 Terms and definitions <\/td>\n<\/tr>\n
17<\/td>\n4 Test procedures
4.1 Visual inspection (MQT 01)
4.1.1 Purpose
4.1.2 Procedure
4.1.3 Requirements
4.2 Maximum power determination (MQT 02)
4.2.1 Purpose
4.2.2 Apparatus <\/td>\n<\/tr>\n
18<\/td>\n4.2.3 Procedure
4.3 Insulation test (MQT 03)
4.3.1 Purpose <\/td>\n<\/tr>\n
19<\/td>\n4.3.2 Apparatus
4.3.3 Test conditions
4.3.4 Procedure
Tables
Table 1 \u2013 Voltage stress levels <\/td>\n<\/tr>\n
20<\/td>\n4.3.5 Test requirements
4.4 Measurement of temperature coefficients (MQT 04)
4.5 Placeholder section, formerly NMOT
4.6 Performance at STC (MQT 06.1)
4.6.1 Purpose
4.6.2 Apparatus <\/td>\n<\/tr>\n
21<\/td>\n4.6.3 Procedure for measuring at STC (MQT 06.1)
4.7 Performance at low irradiance (MQT 07)
4.7.1 Purpose
4.7.2 Apparatus <\/td>\n<\/tr>\n
22<\/td>\n4.7.3 Procedure
4.8 Outdoor exposure test (MQT 08)
4.8.1 Purpose
4.8.2 Apparatus
4.8.3 Procedure <\/td>\n<\/tr>\n
23<\/td>\n4.8.4 Final measurements
4.8.5 Requirements
4.9 Hot-spot endurance test (MQT 09)
4.9.1 Purpose
4.9.2 Hot-spot effect <\/td>\n<\/tr>\n
24<\/td>\n4.9.3 Classification of cell interconnection
Figures
Figure 1 \u2013 Case S, series connection with optional bypass diode
Figure 2 \u2013 Case PS, parallel-series connection with optional bypass diode <\/td>\n<\/tr>\n
25<\/td>\n4.9.4 Apparatus
Figure 3 \u2013 Case SP, series-parallel connection with optional bypass diode <\/td>\n<\/tr>\n
26<\/td>\n4.9.5 Procedure
Figure 4 \u2013 Module I-V characteristics with different cells totally shadowed <\/td>\n<\/tr>\n
28<\/td>\nFigure 5 \u2013 Module I-V characteristics with the test cell shadowed at different levels <\/td>\n<\/tr>\n
29<\/td>\nFigure 6 \u2013 Hot-spot effect in a MLI thin-film module with serially connected cells <\/td>\n<\/tr>\n
33<\/td>\n4.9.6 Final measurements
4.9.7 Requirements
4.10 UV preconditioning test (MQT 10)
4.10.1 Purpose
4.10.2 Apparatus <\/td>\n<\/tr>\n
34<\/td>\n4.10.3 Procedure
4.10.4 Final measurements
4.10.5 Requirements
4.11 Thermal cycling test (MQT 11)
4.11.1 Purpose
4.11.2 Apparatus <\/td>\n<\/tr>\n
35<\/td>\n4.11.3 Procedure
Figure 7 \u2013 Thermal cycling test \u2013 Temperature and applied current profile <\/td>\n<\/tr>\n
36<\/td>\n4.11.4 Final measurements
4.11.5 Requirements
Figure 8 \u2013 Proper attachment of 5 N weight to junction box for module utilizing a) electrical termination leads, b) or wire for attachment, and c) only one junction box <\/td>\n<\/tr>\n
37<\/td>\n4.12 Humidity-freeze test (MQT 12)
4.12.1 Purpose
4.12.2 Apparatus
4.12.3 Procedure
4.12.4 Final measurements
4.12.5 Requirements <\/td>\n<\/tr>\n
38<\/td>\n4.13 Damp heat test (MQT 13)
4.13.1 Purpose
4.13.2 Apparatus
4.13.3 Procedure
Figure 9 \u2013 Humidity-freeze cycle \u2013 Temperature and humidity profile <\/td>\n<\/tr>\n
39<\/td>\n4.13.4 Final measurements
4.13.5 Requirements
4.14 Robustness of terminations (MQT 14)
4.14.1 Purpose
4.14.2 Retention of junction box on mounting surface (MQT 14.1)
4.14.3 Test of cord anchorage (MQT 14.2) <\/td>\n<\/tr>\n
40<\/td>\n4.15 Wet leakage current test (MQT 15)
4.15.1 Purpose
4.15.2 Apparatus
4.15.3 Procedure
4.15.4 Requirements <\/td>\n<\/tr>\n
41<\/td>\n4.16 Static mechanical load test (MQT 16)
4.16.1 Purpose
4.16.2 Apparatus <\/td>\n<\/tr>\n
42<\/td>\n4.16.3 Procedure
4.16.4 Final measurements
4.16.5 Requirements
4.17 Hail test (MQT 17)
4.17.1 Purpose
4.17.2 Apparatus <\/td>\n<\/tr>\n
43<\/td>\n4.17.3 Procedure
Figure 10 \u2013 Hail-test equipment
Table 2 \u2013 Ice-ball masses and test velocities <\/td>\n<\/tr>\n
44<\/td>\n4.17.4 Final measurements
4.17.5 Requirements
Table 3 \u2013 Impact locations <\/td>\n<\/tr>\n
45<\/td>\n4.18 Bypass diode testing (MQT 18)
4.18.1 Bypass diode thermal test (MQT 18.1)
Figure 11 \u2013 Hail test impact locations: top for wafer\/cell based technologies,bottom for monolithic processed thin film technologies <\/td>\n<\/tr>\n
47<\/td>\nFigure 12 \u2013 Bypass diode thermal test <\/td>\n<\/tr>\n
48<\/td>\n4.18.2 Bypass diode functionality test (MQT 18.2) <\/td>\n<\/tr>\n
49<\/td>\n4.19 Stabilization (MQT 19)
4.19.1 General
4.19.2 Criterion definition for stabilization <\/td>\n<\/tr>\n
50<\/td>\n4.19.3 Light induced stabilization procedures <\/td>\n<\/tr>\n
51<\/td>\n4.19.4 Other stabilization procedures
4.19.5 Initial stabilization (MQT 19.1)
4.19.6 Final stabilization (MQT 19.2) <\/td>\n<\/tr>\n
52<\/td>\n4.19.7 Stress-specific stabilization \u2013 BO LID (MQT 19.3)
4.20 Cyclic (dynamic) mechanical load test (MQT 20)
4.20.1 Purpose
4.20.2 Procedure
4.20.3 Final measurements <\/td>\n<\/tr>\n
53<\/td>\n4.20.4 Requirements
4.21 Potential induced degradation test (MQT 21)
4.21.1 Purpose
4.21.2 Samples
4.21.3 Apparatus
4.21.4 Procedure
4.21.5 Final measurements <\/td>\n<\/tr>\n
54<\/td>\n4.21.6 Requirements
4.22 Bending test (MQT 22)
4.22.1 Purpose
4.22.2 Apparatus
4.22.3 Procedure
4.22.4 Final measurements
4.22.5 Requirements <\/td>\n<\/tr>\n
55<\/td>\nAnnex A (informative) Recommended setup for managing weights during mechanical loading (MQT 16)
Figure A.1 \u2013 3D view (at left of figure), end view (at top right), and side view (at bottom right) of gantry crane over mounting jig and loading jig <\/td>\n<\/tr>\n
56<\/td>\nFigure A.2 \u2013 3D close up views of mounting jig (right) and loading jig (left) <\/td>\n<\/tr>\n
57<\/td>\nFigure A.3 \u2013 2D view of mounting jig and loading jig
Figure A.4 \u2013 3D view of loading jig <\/td>\n<\/tr>\n
58<\/td>\nFigure A.5 \u2013 Close-up view of loading jig <\/td>\n<\/tr>\n
59<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Terrestrial photovoltaic (PV) modules. Design qualification and type approval – Test procedures<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n60<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":371699,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-371694","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/371694","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/371699"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=371694"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=371694"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=371694"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}