{"id":420110,"date":"2024-10-20T06:29:22","date_gmt":"2024-10-20T06:29:22","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-ts-62647-212013-2\/"},"modified":"2024-10-26T12:08:07","modified_gmt":"2024-10-26T12:08:07","slug":"bsi-pd-iec-ts-62647-212013-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-ts-62647-212013-2\/","title":{"rendered":"BSI PD IEC\/TS 62647-21:2013"},"content":{"rendered":"

This part of IEC 62647 is designed to assist program management and\/or systems engineering management in managing the transition to lead -free (Pb-free) electronics to assure product reliability and performance .<\/p>\n

Manufacturers of Aerospace, Defence and High Performance (ADHP) electronics may inadvertently introduce Pb -free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordina tion between buyer and supplier is not exercised . For example, piece part manufacturers may not always change part numbers to identify Pb -free finishes, especially if the previous tin -lead (Sn-Pb) finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection , while crucial, may not be sufficient to identify Pb -free piece parts.<\/p>\n

\n

NOTE 1 Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations . The industry conversion to Pb -free solder technology may affect an ADHP program in one or both of the following ways:<\/p>\n<\/blockquote>\n