{"id":421319,"date":"2024-10-20T06:35:34","date_gmt":"2024-10-20T06:35:34","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-63072-12017-2\/"},"modified":"2024-10-26T12:20:34","modified_gmt":"2024-10-26T12:20:34","slug":"bsi-pd-iec-tr-63072-12017-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-63072-12017-2\/","title":{"rendered":"BSI PD IEC\/TR 63072-1:2017"},"content":{"rendered":"

This part of IEC 63072, which is a Technical Report, provides an introduction to photonic integrated circuits (PICs) and describes a roadmap for the standardization of PIC technology over the next decade.<\/p>\n

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NOTE The trademarks and trade names mentioned in this document are given for the convenience of users of this document; this does not constitute an endorsement by IEC of these companies.<\/p>\n<\/blockquote>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
6<\/td>\nCONTENTS <\/td>\n<\/tr>\n
9<\/td>\nFOREWORD <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
13<\/td>\n4 Photonic integrated circuit (PIC)
4.1 Overview <\/td>\n<\/tr>\n
15<\/td>\n4.2 PIC families
4.2.1 General
Figures
Figure 1 \u2013 Examples of PICs [1] <\/td>\n<\/tr>\n
16<\/td>\n4.2.2 Silicon photonics
4.2.3 III-V photonics
4.2.4 Silica and silicon nitride PICs
Figure 2 \u2013 Optical beam forming network fabricated in TriPleX (silicon nitride) <\/td>\n<\/tr>\n
17<\/td>\n4.3 Manufacturing capabilities
4.4 Global market
4.5 Global government investment in PIC research and development
4.5.1 General
4.5.2 United States of America
4.5.3 Europe
4.5.4 Japan <\/td>\n<\/tr>\n
18<\/td>\n5 Silicon photonics
5.1 Overview
5.2 Integration schemes
5.2.1 General
Figure 3 \u2013 Typical silicon waveguides [6] <\/td>\n<\/tr>\n
19<\/td>\n5.2.2 Heterogeneous integration
5.2.3 Homogenous integration
5.3 Non-linear behaviour
6 III-V photonics
6.1 Indium phosphide (InP) photonics
Figure 4 \u2013 Heterogeneous integration by flip chip and copper pillars <\/td>\n<\/tr>\n
20<\/td>\nFigure 5 \u2013 Indium phosphide PIC with many structures, including AWG <\/td>\n<\/tr>\n
21<\/td>\n7 PIC transceiver \u2013 A simple example
7.1 Overview
7.2 Transmitter section
Figure 6 \u2013 Combined InP and TriPleX microwave photonic beam-forming network <\/td>\n<\/tr>\n
22<\/td>\n7.3 Receiver section
Figure 7 \u2013 Schematic of four channel PIC transceiver by Luxtera [6] <\/td>\n<\/tr>\n
23<\/td>\n8 Optical sources
8.1 Overview
8.2 Advances in III-V integration onto silicon PICs <\/td>\n<\/tr>\n
24<\/td>\n8.3 Vertical cavity surface emitting lasers (VCSELs)
9 Optical receivers
Figure 8 \u2013 Schematic view of 3D assembly of PIC + EIC electro-optical assembly [6] <\/td>\n<\/tr>\n
25<\/td>\n10 Modulators
10.1 Overview
10.2 Common modulator structures
Figure 9 \u2013 Example of Ge-on-Si photodetector formed by germanium selective epitaxy [6] <\/td>\n<\/tr>\n
26<\/td>\n10.3 Plasma dispersion effect
Figure 10 \u2013 High speed PN modulator [6] <\/td>\n<\/tr>\n
27<\/td>\n10.4 Plasmonics
10.5 Silicon organic hybrid
Figure 11 \u2013 PETRA optical I\/O core chip modulation scheme <\/td>\n<\/tr>\n
28<\/td>\n11 Switches
11.1 Overview
11.2 Mach-Zehnder interferometers (MZI)
11.3 Micro-ring resonator (MRR)
Figure 12 \u2013 Silicon organic hybrid <\/td>\n<\/tr>\n
29<\/td>\n11.4 Double-ring assisted MZI (DR-MZI)
12 3D integration
12.1 Optochip
12.2 Through-silicon-vias (TSVs)
Figure 13 \u2013 4 x 4 switching matrix PIC attached to PCB with wire bonds on the EU FP7 PhoxTroT project <\/td>\n<\/tr>\n
30<\/td>\n12.3 Hybrid integration process example
12.4 Flip-chip bonding
Figure 14 \u2013 EU FP7 project PhoxTroT 3D integrated optochip concept <\/td>\n<\/tr>\n
31<\/td>\n12.5 State of the art in 3D research and development
13 Commercial state of the art
13.1 Overview
13.2 Luxtera
Figure 15 \u2013 LIFT principle <\/td>\n<\/tr>\n
32<\/td>\n13.3 Intel
13.4 Mellanox <\/td>\n<\/tr>\n
33<\/td>\n13.5 Oracle
13.6 IBM
13.7 Photonics Electronics Technology Research Association (PETRA)
Figure 16 \u2013 PETRA optical I\/O core performance at 25 Gb\/s <\/td>\n<\/tr>\n
34<\/td>\n14 PIC coupling interfaces
14.1 Overview
14.2 Grating coupler <\/td>\n<\/tr>\n
35<\/td>\nFigure 17 \u2013 Examples of vertical grating couplers [6] <\/td>\n<\/tr>\n
36<\/td>\nFigure 18 \u2013 Coupling efficiency of single polarization grating coupler (SPGC) at 1 310 nm and 1 490 nm [91]
Figure 19 \u2013 Composite coupling interfaces on PETRA optical I\/O core <\/td>\n<\/tr>\n
37<\/td>\n14.3 Adiabatic coupling
Figure 20 \u2013 Assembly for adiabatic optical coupling between Si photonics chip and SM polymer waveguide <\/td>\n<\/tr>\n
38<\/td>\nFigure 21 \u2013 Flip-chipped silicon photonic chip onto polymer waveguide substrate using adiabatic coupling <\/td>\n<\/tr>\n
39<\/td>\n14.4 Butt coupling
14.5 Orthogonal chip-to-fibre coupling
Figure 22 \u2013 Bidirectional optical coupling between SOI waveguides and single polymer waveguides <\/td>\n<\/tr>\n
40<\/td>\n15 Electrical interface
Figure 23 \u2013 Design of the mirror plug assembly <\/td>\n<\/tr>\n
41<\/td>\n16 Packaging
17 Standardization roadmap
Figure 24 \u2013 Typical operative framework of silicon-photonics modules <\/td>\n<\/tr>\n
42<\/td>\nFigure 25 \u2013 PIC standardization roadmap <\/td>\n<\/tr>\n
43<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Photonic integrated circuits – Introduction and roadmap for standardization<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2017<\/td>\n54<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":421328,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[652,2641],"product_tag":[],"class_list":{"0":"post-421319","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-33-180-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/421319","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/421328"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=421319"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=421319"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=421319"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}