ASHRAE LiquidCoolingGuidelinesforDatacomEquipmentCenters 06 2006
$42.79
Liquid Cooling Guidelines for Datacom Equipment Centers
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2006 | 102 |
Data center IT equipment today is predominantly air cooled. However, with rack heat loads steadily climbing, the ability for many data centers to deliver either adequate airflow rates or sufficient chilled air is now being stretched to the limit. These trends in the heat load generated from IT equipment can have detrimental side effects, such as decresed equipment availability, wasted floor space, and inefficient cooling system operation. This situation is creating a need for implementing liquid cooling solutions. The overall goals of the liquid implementations include aspects such as trasferring as much waste heat to the facility liquid cooling loop as possible, reducing the overall volume of airflow needed by the racks, and reducing processor temperatures such that increased compute performance can be achieved.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 11 | 1.1 Definitions |
| 13 | 1.2 Liquid Cooling Systems |
| 14 | Figure 1.1 Liquid cooling systems/loops within a data center. |
| 16 | 2.1 Introduction 2.1.1 Flexibility |
| 17 | 2.1.2 Scalability 2.1.3 Ease of Installation, Commissioning, and Operation |
| 18 | 2.1.4 Ease of Maintenance and Troubleshooting |
| 19 | 2.1.5 Availability and Reliability |
| 21 | 2.2 Equipment Figure 2.1 Generic chiller diagram. 2.2.1 Chillers |
| 22 | Figure 2.2 Schematic overview of a generic air-cooled chiller flow. Figure 2.3 Typical packaged air-cooled chiller. |
| 23 | Figure 2.4 Schematic overview of a generic water-cooled chiller flow. Figure 2.5 Water-cooled chiller. |
| 24 | 2.3 Heat Rejection Equipment Figure 2.6 Schematic overview of a generic cooling tower flow. Figure 2.7 Direct cooling towers on an elevated platform. |
| 25 | 2.4 Pumps |
| 26 | Figure 2.8 Direct or open circuit cooling tower schematic flow diagram. Figure 2.9 Indirect cooling tower schematic flow diagram. 2.5 Energy Recovery Equipment |
| 27 | Figure 2.10 Simple overview of the heat exchanger process. |
| 28 | Figure 2.11 Insulated plate and frame heat exchangers. |
| 30 | 3.1 General |
| 31 | 3.2 Spatial considerations 3.3 Basic Piping Architecture |
| 32 | Direct Return (Figure 3.1) Figure 3.1 Example of direct return flow principle. |
| 34 | Figure 3.2 Example of reverse return flow principle. |
| 35 | Figure 3.3 Single-ended loop with direct feed. |
| 37 | Figure 3.4 Single-ended loop with common cross branches. |
| 38 | Figure 3.5 Single-ended loop with dedicated cross branches. |
| 39 | Figure 3.6 Double-ended loop with direct feed. |
| 40 | Figure 3.7 Double-ended loop with common cross branches. |
| 41 | 3.4 Piping Arrangements for the Cooling Plant |
| 42 | 3.4.1 CHWS Pipe Sizing Figure 3.8 Double-ended loop with dedicated cross branches. |
| 43 | 3.4.2 Loop Isolation Valve Failures Figure 3.9 Condenser water system/chilled-water system distribution piping. |
| 44 | 3.5 Water Treatment Issues 3.6 Earthquake Protection |
| 46 | 4.1 Overview of Liquid-Cooled Racks and Cabinets |
| 47 | Figure 4.1 Air-cooled rack or cabinet. Figure 4.2 Combination air- and liquid-cooled rack or cabinet. |
| 48 | Figure 4.3 Liquid-cooled rack or cabinet (side view). |
| 49 | Figure 4.4 Combination air- and liquid-cooled rack or cabinet with external CDU. Figure 4.5 Liquid-cooled rack or cabinet with external CDU. |
| 50 | Figure 4.6 Combination air- and liquid-cooled rack or cabinet with internal CDU. Figure 4.7 Liquid-cooled rack or cabinet with internal CDU. |
| 51 | Figure 4.8 Open air-cooled datacom equipment in an air/liquid-cooled rack. 4.2 Overview of Air- and Liquid-Cooled Datacom Equipment |
| 52 | Figure 4.9 Closed air-cooled datacom equipment in a liquid-cooled cabinet. |
| 53 | Figure 4.10 Liquid-cooled datacom equipment in a liquid-cooled rack. Figure 4.11 Open air- and liquid-cooled datacom equipment in an air/liquid- cooled rack. |
| 54 | Figure 4.12 Closed air- and liquid-cooled datacom equipment in a liquid- cooled rack. 4.3 Overview of Coolant Distribution Unit (CDU) |
| 55 | Figure 4.13 Liquid-cooled datacom equipment in a liquid-cooled rack using a vapor-compression system. Figure 4.14 Air-cooled datacom equipment in a liquid-cooled cabinet using a vapor-compression cycle. |
| 57 | Figure 4.15 Internal datacom equipment-based CDU that utilizes a docking station and cold plates. |
| 58 | Figure 4.16 Internal datacom equipment-based CDU that utilizes a liquid- to-liquid heat exchanger. Figure 4.17 Internal rack or cabinet-based CDU that utilizes a liquid-to- liquid heat exchanger. |
| 59 | Figure 4.18 Internal rack or cabinet-based CDU that utilizes a liquid-cooled condenser and a vapor-compression system. |
| 60 | Figure 4.19 Facility-based CDU that utilizes a liquid-cooled condenser. Figure 4.20 Facility-based CDU that utilizes a liquid-cooled condenser and a vapor-compression system. |
| 62 | 5.1 Building Facility Chilled-Water Systems (CHWS) 5.1.1 Chilled-Water Details |
| 63 | Figure 5.1 Combination air- and liquid-cooled rack or cabinet with external CDU (same as Figure 4.5). Figure 5.2 Combination air- and liquid-cooled rack or cabinet with internal CDU (same as Figure 4.6). |
| 65 | Figure 5.3 Typical chiller water flow rates for constant heat load. |
| 66 | Table 5.1 Maximum Velocity Requirements Table 5.2 Water Quality Specifications for the Chilled-Water System (CHWS) Loop |
| 68 | 5.1.2 Piping Considerations |
| 69 | Figure 5.4 Location of CDU units in data center-Option 1. |
| 70 | Figure 5.5 Location of CDU units in data center-Option 2. |
| 71 | 5.1.3 Electrical Considerations |
| 72 | 5.1.4 Monitoring |
| 73 | 5.1.5 Reliability and Availability |
| 77 | 5.1.6 Commissioning |
| 78 | 5.2 Non-Chilled-Water Facility Systems 5.2.1 Air-Cooled Condensers 5.2.2 Refrigerant Piping |
| 79 | Figure 5.6 CDU (DX unit) supplying coolant to rack or cabinet. Figure 5.7 Modular CDU (DX unit) within rack or cabinet. |
| 82 | Figure 6.1 Combination air- and liquid-cooled rack or cabinet with external CDU (same as Figure 4.5). 6.1 Water-Based Technology Cooling System |
| 83 | Figure 6.2 Water flow rates for TCS loop and for constant heat load. 6.1.1 Operational Requirements 6.1.2 Water Flow Rates |
| 84 | 6.1.3 Velocity Considerations 6.1.4 Water Quality/Composition Table 6.1 Maximum Velocity Requirements |
| 85 | Table 6.2 Water Quality Specifications-TCS Cooling Loop |
| 86 | 6.1.5 Wetted Material Requirements 6.1.6 Monitoring 6.2 Non-Water-Based Technology Cooling System |
| 87 | 6.2.1 Operational Requirements 6.2.2 Liquid Requirements 6.2.3 Wetted Material Requirements |
| 96 | Survey of Customer Water Quality of Chilled-Water System Loop |
