BS EN 60191-6-12:2011
$142.49
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 24 |
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: – scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: “Rectangular type” has been deleted from the title; – ball pitch of 0,3 mm has been added; – datum is changed from the body datum to the ball datum; – combination lists of D, E, MD, and ME have been revised.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions |
| 8 | 4 Terminal position numbering 5 Nominal package dimension Figures Figure 1 – Flange-type FLGA Figure 2 – Rectangle-type FLGA |
| 9 | 6 Outline drawings and principle dimensions Figure 3 – Flange-type FLGA |
| 10 | Figure 4 – Rectangle-type FLGA |
| 11 | Figure 5 – Mechanical gauge drawing Figure 6 – Pattern of terminal position area |
| 12 | 7 Dimensions Tables Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability |
| 16 | Table 2 – Group 2: Dimensions and tolerances |
| 17 | Table 3 – Combination list of D, E, MD, and ME – e = 0,80mm pitch |
| 18 | Table 4 – Combination list of D, E, MD, and ME – e = 0,65 mm pitch |
| 19 | Table 5 – Combination list of D, E, MD, and ME – e = 0,50 mm pitch |
| 20 | Table 6 – Combination list of D, E, MD, and ME – e = 0,40 mm pitch |
| 21 | Table 7 – Combination list of D, E, MD, and ME – e = 0,30 mm pitch |
