BS IEC 62951-8:2023
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for stretchability, flexibility, and stability of flexible resistive memory
| Published By | Publication Date | Number of Pages |
| BSI | 2023 | 18 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions |
| 8 | 4 Test method 4.1 General 4.2 Test equipment and tools Tables Table 1 – Performance parameters of resistive type memory |
| 9 | Figures Figure 1 – Examples experimental setup for testing stretchability (top)and flexibility (bottom) |
| 10 | 4.3 Test procedures 4.3.1 Stretchability test |
| 11 | 4.3.2 Flexibility test Figure 2 – Schematic for stretchability test denoting parametersbefore and during testing |
| 12 | 4.3.3 Stability testing Figure 3 – Schematic for flexibility test denoting parameters before and during testing |
| 13 | 4.4 Test report Table 2 – Example temperature and relative humidity conditions |
| 14 | Annex A (informative)Induced strain on a substrate due to bending A.1 Detailed derivation of the strain formula by bending Figure A.1 – Deformation of a substrate induced strain by bending |
| 15 | A.2 Simulation results induced strain by bending Figure A.2 – Deformation of a substrate induced tensile strain by stretching |
| 16 | Bibliography |
