IEC 60749-20:2008
$50.05
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques – Partie 20: Résistance des CMS à boîtier plastique à l’effet combiné de l’humidité et de la chaleur de brasage
| Published By | Publication Date | Number of Pages |
| IEC | 2008-12-09 | 58 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2008-12-09 |
| Pages Count | 58 |
| Language | France |
| Edition | 2.0 |
| File Size | 1.4 MB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
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