{"id":233413,"date":"2024-10-19T15:12:47","date_gmt":"2024-10-19T15:12:47","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60191-6-222013\/"},"modified":"2024-10-25T09:42:43","modified_gmt":"2024-10-25T09:42:43","slug":"bs-en-60191-6-222013","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60191-6-222013\/","title":{"rendered":"BS EN 60191-6-22:2013"},"content":{"rendered":"

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
5<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
6<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions <\/td>\n<\/tr>\n
7<\/td>\n6 Symbols and drawings
Figures
Figure 1 \u2013 S-FBGA outline <\/td>\n<\/tr>\n
8<\/td>\nFigure 2 \u2013 S-FLGA outline <\/td>\n<\/tr>\n
9<\/td>\nFigure 3 \u2013 Mechanical gauge drawing
Figure 4 \u2013 Array of terminal-existence areas <\/td>\n<\/tr>\n
10<\/td>\n7 Dimensions
7.1 Group 1
Tables
Table 1 \u2013 Dimensions and tolerances in Group 1 <\/td>\n<\/tr>\n
12<\/td>\n7.2 Group 2
Table 2 \u2013 Dimensions and tolerances of Group 2 <\/td>\n<\/tr>\n
13<\/td>\n8 Combination list of D, E, MD, and ME
Table 3 \u2013 e = 0,80 mm pitch S-FBGA and S-FLGA
Table 4 \u2013 e = 0,65 mm pitch S-FBGA and S-FLGA <\/td>\n<\/tr>\n
14<\/td>\nTable 5 \u2013 e = 0,50 mm pitch S-FBGA and S-FLGA <\/td>\n<\/tr>\n
15<\/td>\nTable 6 \u2013 e = 0,40 mm pitch S-FBGA and S-FLGA <\/td>\n<\/tr>\n
16<\/td>\nTable 7 \u2013 e = 0,30 mm pitch S-FBGA and S-FLGA <\/td>\n<\/tr>\n
17<\/td>\nTable 8 \u2013 e = 0,25 mm pitch S-FLGA <\/td>\n<\/tr>\n
18<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2013<\/td>\n20<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233416,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2641],"product_tag":[],"class_list":{"0":"post-233413","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233413","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233416"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233413"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233413"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233413"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}