{"id":459896,"date":"2024-10-20T10:06:35","date_gmt":"2024-10-20T10:06:35","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61189-2-8082024\/"},"modified":"2024-10-26T18:40:29","modified_gmt":"2024-10-26T18:40:29","slug":"bs-en-iec-61189-2-8082024","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61189-2-8082024\/","title":{"rendered":"BS EN IEC 61189-2-808:2024"},"content":{"rendered":"
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Objective <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5 Test specimen Figures Figure 1 \u2013 Structure of an assembly Figure 2 \u2013 The fabricated test sample <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 6 Test equipment and procedures 6.1 Test method and recommended test parameters 6.2 Test equipment <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 6.3 Test procedure 7 Test result Figure 3 \u2013 Test structure for measuring thermal resistance <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 8 Report Figure 4 \u2013 Test result for thermal resistance of an assembly Tables Table 1 \u2013 Test result for thermal resistance of an assembly <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Annex A (informative) Additional test methods for thermal resistance Table A.1 \u2013 ASTM C1113 Table A.2 \u2013 ASTM E1461 <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Table A.3 \u2013 ASTM D5470 <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Annex B (informative) Thermal resistance of die attach materials B.1 Test specimen B.2 Die attach materials Figure B.1 \u2013Structure of test sample using die attach material Figure B.2 \u2013The fabricated test sample using die attach material <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | B.3 Test result Table B.1 \u2013 Properties for die attach materials <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Figure B.3 \u2013 Test graph for die attach materials Table B.2 \u2013 Test result for die attach materials <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Annex C (informative) Uncertainty and repeatability for thermal resistance test C.1 Test specimen C.2 Test result Figure C.1 \u2013 Test structure for measuring thermal resistance Figure C.2 \u2013 Test result for thermal resistance of assembly <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Table C.1 \u2013 Test result for thermal resistance of assembly <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Annex D (informative) Thermostat equipment Figure D.1 \u2013 Connection of the thermostat unit to the T3Ster\u00ae main system unit <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure D.2 \u2013Calibration diagram recorded by the T3Ster\u00ae thermostat <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Test methods for electrical materials, printed board and other interconnection structures and assemblies – Thermal resistance of an assembly by thermal transient method<\/b><\/p>\n |