IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 5<\/td>\n | English \n CONTENTS <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Test apparatus 4.1 General <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | 4.2 Actuator 4.3 Load tip 4.4 Alignment mechanism 4.5 Force and displacement sensors 4.6 Test environment 5 Test piece 5.1 General <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 5.2 Shape of test piece 5.3 Measurement of test piece dimension Figures \n Figure 1 \u2013 Thin film test piece Table 1 \u2013 Symbols and designations of a test piece <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 6 Test procedure and analysis 6.1 General 6.2 Data analysis <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 7 Test report Figure 2 \u2013 Schematic of strip bending test <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | Annex A (informative) Data analysis: Test results by using nanoindentation apparatus \n Figure A.1 \u2013 Three successive indents for determining the reference location of a test piece <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | Figure A.2 \u2013 A schematic view of nanoindentation apparatus Figure A.3 \u2013 Actuator force vs. deflection curvesfor strip bending test and for leaf spring test <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Figure A.4 \u2013 Force vs. deflection curve of a test piece \nafter compensating the stiffness of the leaf spring <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Annex B (informative) \nTest piece fabrication: MEMS process Figure B.1 \u2013 Fabrication procedure for test piece <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Annex C (informative) \nEffect of misalignment and geometry on property measurement <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Figure C.1 \u2013 Finite element analysis of errors based on the constitutive dataof Au thin film of 1 \num thick <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Figure C.2 \u2013 Translational (d) and angular (a, b, y \n) misalignments <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Micro-electromechanical devices – Strip bending test method for tensile property measurement of thin films<\/b><\/p>\n |