{"id":237150,"date":"2024-10-19T15:29:16","date_gmt":"2024-10-19T15:29:16","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60068-2-692017a12019\/"},"modified":"2024-10-25T10:07:36","modified_gmt":"2024-10-25T10:07:36","slug":"bs-en-60068-2-692017a12019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60068-2-692017a12019\/","title":{"rendered":"BS EN 60068-2-69:2017+A1:2019"},"content":{"rendered":"

This part of IEC 60068 outlines test Te\/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass\u2013fail purposes.<\/p>\n

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.<\/p>\n

This document provides the measurement procedures for solder alloys both with and without lead (Pb).<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nNational foreword <\/td>\n<\/tr>\n
5<\/td>\nBlank Page <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
10<\/td>\nFOREWORD <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
13<\/td>\n4 General description of the method
4.1 General
4.2 Components
4.3 Printed boards
4.4 Measurement
5 Description of the test apparatus <\/td>\n<\/tr>\n
14<\/td>\nFigure 1 \u2013 Arrangement for the test apparatus (solder bath wetting balance method)
Figure 2 \u2013 Arrangement for the test apparatus (solder globule wetting balance method) <\/td>\n<\/tr>\n
15<\/td>\n6 Preparation of specimens
6.1 Cleaning
6.2 Preconditioning
Figures
Tables
Table 1 \u2013 Preconditioning <\/td>\n<\/tr>\n
16<\/td>\n7 Materials
7.1 Solder
7.1.1 General
7.1.2 Solder alloy containing lead
7.1.3 Lead-free solder alloy
7.1.4 Solder contamination control <\/td>\n<\/tr>\n
17<\/td>\n7.1.5 Solder mass for solder globule wetting balance method
Table 2 \u2013 Maximum limits of solder bath contaminants
Table 3 \u2013 Pin diameter and solder pellet mass <\/td>\n<\/tr>\n
18<\/td>\n7.2 Flux
7.2.1 Rosin based flux
7.2.2 Flux maintenance
7.2.3 Test flux selection criteria
8 Procedure
8.1 Test temperature
8.1.1 Solder alloy containing lead
8.1.2 Lead-free solder alloy
8.2 Test procedure
8.2.1 Applicable test procedure
Table 4 \u2013 Rosin based flux compositions <\/td>\n<\/tr>\n
19<\/td>\n8.2.2 Solder bath wetting balance procedure <\/td>\n<\/tr>\n
20<\/td>\nTable 5 \u2013 Recommended solder bath wetting balance test conditions <\/td>\n<\/tr>\n
21<\/td>\nFigure 3 \u2013 Immersion conditions for solder bath method <\/td>\n<\/tr>\n
22<\/td>\n8.2.3 Solder globule wetting balance procedure
Table 6 \u2013 Time sequence of the test (solder bath) <\/td>\n<\/tr>\n
23<\/td>\nTable 7 \u2013 Recommended solder globule wetting balance test conditions <\/td>\n<\/tr>\n
24<\/td>\nFigure 4 \u2013 Immersion conditions for solder globule method <\/td>\n<\/tr>\n
25<\/td>\n8.2.4 Procedure for testing printed board specimens
Table 8 \u2013 Time sequence of the test (solder globule) <\/td>\n<\/tr>\n
26<\/td>\nFigure 5 \u2013 Suggested wetting balance test specimens for printed boards <\/td>\n<\/tr>\n
27<\/td>\nFigure 6 \u2013 Printed board immersion <\/td>\n<\/tr>\n
28<\/td>\n9 Presentation of results
9.1 Form of force versus time trace
Figure 7 \u2013 Typical wetting balance trace <\/td>\n<\/tr>\n
29<\/td>\n9.2 Test requirements
10 Information to be given in the relevant specification <\/td>\n<\/tr>\n
30<\/td>\nAnnexes
Annex A (normative) Equipment specification
A.1 Characteristics of the apparatus
A.2 Solder bath <\/td>\n<\/tr>\n
31<\/td>\nA.3 Globule support blocks <\/td>\n<\/tr>\n
32<\/td>\nAnnex B (informative) Use of the wetting balance for SMD solderability testing
B.1 Definition of the measure of solderability
B.2 Gauge R&R \u2013 Test protocol for wetting balance gauge repeatability and reproducibility using copper foil coupons
B.2.1 Test coupon <\/td>\n<\/tr>\n
33<\/td>\nB.2.2 Test parameters
B.2.3 Known good coupon <\/td>\n<\/tr>\n
34<\/td>\nB.3 Solder pellet mass and pin diameter
B.4 Specimen orientation and immersion depth
B.4.1 General <\/td>\n<\/tr>\n
35<\/td>\nB.4.2 Resistors and capacitors
B.4.3 Small-leaded components
B.4.4 Multi-leaded devices <\/td>\n<\/tr>\n
36<\/td>\nB.5 Test flux
Table B.1 \u2013 Carboxylic acid based flux (water solution)
Table B.2 \u2013 Carboxylic acid based flux (alcohol solution) <\/td>\n<\/tr>\n
37<\/td>\nB.6 Test temperature
B.6.1 Solder alloy containing lead
B.6.2 Solder alloy without lead
B.7 Characteristics of the test apparatus
B.7.1 Recording device <\/td>\n<\/tr>\n
38<\/td>\nB.7.2 Balance system
B.7.3 Lifting mechanism and controls <\/td>\n<\/tr>\n
41<\/td>\nFigure B.1 \u2013 Understanding wetting curves <\/td>\n<\/tr>\n
42<\/td>\nFigure B.2 \u2013 Typical wetting curve <\/td>\n<\/tr>\n
43<\/td>\nB.7.4 Parameters to be measured from the force-time trace
Figure B.3 \u2013 Representative force-time curves <\/td>\n<\/tr>\n
44<\/td>\nB.7.5 Reference wetting force <\/td>\n<\/tr>\n
45<\/td>\nB.7.6 Equipment location
B.7.7 Globule pins
B.7.8 Globule modules
B.8 Test flux \u2013 IPC-J-STD-002\/J-STD-003 activated solderability test flux rationale committee letter
B.8.1 General
B.8.2 Proactive solderability testing approach to the implementation of non-tin finishes <\/td>\n<\/tr>\n
46<\/td>\nB.8.3 Reduced solderability test variability
B.8.4 Standardization of solderability test flux composition on a global scale <\/td>\n<\/tr>\n
47<\/td>\nAnnex C (normative) Test methods for SMD components sizes 0603M (0201) or smaller
C.1 General
C.2 General description of the test method
C.3 Preconditioning
C.3.1 Preparation of the specimens
C.3.2 Ageing
C.4 Materials
C.4.1 Solder <\/td>\n<\/tr>\n
48<\/td>\nC.4.2 Flux
C.5 Method 1
C.5.1 Description of the test apparatus
C.5.2 Procedures
Figure C.1 \u2013 Cross-section of aluminium body <\/td>\n<\/tr>\n
49<\/td>\nFigure C.2 \u2013 Dipping position and relative position <\/td>\n<\/tr>\n
50<\/td>\nTable C.1 \u2013 Time sequence of the test procedure <\/td>\n<\/tr>\n
51<\/td>\nC.5.3 Presentation of results
Figure C.3 \u2013 Time and test sequence <\/td>\n<\/tr>\n
52<\/td>\nC.5.4 Information to be given in the relevant specification
Figure C.4 \u2013 Typical wetting balance trace <\/td>\n<\/tr>\n
53<\/td>\nC.6 Method 2
C.6.1 Test apparatus
C.6.2 Observation equipment
C.6.3 Test method 2 <\/td>\n<\/tr>\n
54<\/td>\nC.6.4 Presentation of results <\/td>\n<\/tr>\n
55<\/td>\nAnnex D (informative) Evaluation criteria \u2013 Guidance
D.1 General considerations
D.2 Evaluation criteria for components
Table D.1 \u2013 Wetting balance parameter and suggested evaluation criteria <\/td>\n<\/tr>\n
56<\/td>\nD.3 Evaluation criteria for printed boards
Figure D.1 \u2013 Set A wetting curve
Figure D.2 \u2013 Set B wetting curve
Table D.2 \u2013 Printed board test parameter and suggested criteria <\/td>\n<\/tr>\n
57<\/td>\nAnnex E (informative) Method of calculating the maximum theoretical force and integrated value of the area of the wetting curve for leaded non-SMD
E.1 Method of calculating the maximum theoretical force
E.2 Method of calculating the integrated value of the area of the wetting curve <\/td>\n<\/tr>\n
59<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Environmental testing – Tests. Test Te\/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n60<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":237153,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-237150","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/237150","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/237153"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=237150"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=237150"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=237150"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}