| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 3<\/td>\n | TitlePage – Surface chemical analysis\ufffd\u2014 Guidelines for preparation and mounting of specimens for … <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | TableofContent – Contents Page <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | Foreword – Foreword <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | Introduction – Introduction <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | Scope – 1\ufffd\ufffd\ufffd Scope NormativeReference – 2\ufffd\ufffd\ufffd Normative references Clause1 – 4\ufffd\ufffd\ufffd Symbols and abbreviated terms Clause1 – 5\ufffd\ufffd\ufffd General requirements <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | Clause1 – 6\ufffd\ufffd\ufffd Visual inspection of the specimen Clause1 – 7\ufffd\ufffd\ufffd Specimen considerations Subclause2 – 7.1\ufffd\ufffd\ufffd History Subclause2 – 7.2\ufffd\ufffd\ufffd Information sought Subclause2 – 7.3\ufffd\ufffd\ufffd Specimens previously examined by other analytical techniques <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | Clause1 – 8\ufffd\ufffd\ufffd Sources of specimen contamination Subclause2 – 8.1\ufffd\ufffd\ufffd Tools, gloves, mounts and similar materials Subclause2 – 8.2\ufffd\ufffd\ufffd Exposure to gases Subclause2 – 8.3\ufffd\ufffd\ufffd Exposure to instrumental vacuum Subclause2 – 8.4\ufffd\ufffd\ufffd Exposure to electrons, ions, and X-rays <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | Subclause2 – 8.5\ufffd\ufffd\ufffd Contamination of the analytical chamber Clause1 – 9\ufffd\ufffd\ufffd Specimen storage and transfer Subclause2 – 9.1\ufffd\ufffd\ufffd Storage time Subclause2 – 9.2\ufffd\ufffd\ufffd Storage containers Subclause2 – 9.3\ufffd\ufffd\ufffd Temperature and humidity <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Subclause2 – 9.4\ufffd\ufffd\ufffd Specimen transfer Clause1 – 10\ufffd\ufffd\ufffd Specimen mounting procedures Subclause2 – 10.1\ufffd\ufffd\ufffd General procedures Subclause2 – 10.2\ufffd\ufffd\ufffd Powders and particles <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Subclause2 – 10.3\ufffd\ufffd\ufffd Wires, fibres and filaments Subclause2 – 10.4\ufffd\ufffd\ufffd Pedestal mounting Subclause2 – 10.5\ufffd\ufffd\ufffd Reduction of thermal damage during analysis Clause1 – 11\ufffd\ufffd\ufffd Methods for reducing specimen charging Subclause2 – 11.1\ufffd\ufffd\ufffd General considerations Subclause2 – 11.2\ufffd\ufffd\ufffd Conductive mask, grid, wrap or coating <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Subclause2 – 11.3\ufffd\ufffd\ufffd Flood gun Subclause2 – 11.4\ufffd\ufffd\ufffd Electron and ion beams Subclause3 – 11.4.1\ufffd\ufffd\ufffd Angle of incidence of the primary beam in AES Subclause3 – 11.4.2\ufffd\ufffd\ufffd Energy of the primary beam in AES and SIMS Subclause3 – 11.4.3\ufffd\ufffd\ufffd Current density of the primary beam in AES and SIMS Subclause3 – 11.4.4\ufffd\ufffd\ufffd Combined electron and ion beams in AES Clause1 – 12\ufffd\ufffd\ufffd Specimen preparation techniques Subclause2 – 12.1\ufffd\ufffd\ufffd General considerations Subclause2 – 12.2\ufffd\ufffd\ufffd Mechanical separation <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Subclause2 – 12.3\ufffd\ufffd\ufffd Thinning versus removal Subclause2 – 12.4\ufffd\ufffd\ufffd Removal of the substrate Subclause2 – 12.5\ufffd\ufffd\ufffd Sectioning techniques Subclause3 – 12.5.1\ufffd\ufffd\ufffd General information Subclause3 – 12.5.2\ufffd\ufffd\ufffd Sectioning methods Subclause3 – 12.5.3\ufffd\ufffd\ufffd Angle lapping Subclause3 – 12.5.4\ufffd\ufffd\ufffd Ball cratering <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Subclause3 – 12.5.5\ufffd\ufffd\ufffd Radial sectioning Subclause3 – 12.5.6\ufffd\ufffd\ufffd Mechanical polishing Subclause3 – 12.5.7\ufffd\ufffd\ufffd Chemical and electrochemical polishing Subclause3 – 12.5.8\ufffd\ufffd\ufffd Crater edge profiling Subclause3 – 12.5.9\ufffd\ufffd\ufffd Focused ion beam sectioning Subclause2 – 12.6\ufffd\ufffd\ufffd Growth of overlayers Subclause2 – 12.7\ufffd\ufffd\ufffd Solvents <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Subclause2 – 12.8\ufffd\ufffd\ufffd Chemical etching Subclause2 – 12.9\ufffd\ufffd\ufffd Ion sputtering Subclause3 – 12.9.1\ufffd\ufffd\ufffd General information Subclause3 – 12.9.2\ufffd\ufffd\ufffd Altered layer Subclause3 – 12.9.3\ufffd\ufffd\ufffd Preferential sputtering Subclause3 – 12.9.4\ufffd\ufffd\ufffd Chemical changes Subclause3 – 12.9.5\ufffd\ufffd\ufffd Sputtering with hydrogen Subclause3 – 12.9.6\ufffd\ufffd\ufffd Changes of surface and interface topography <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Subclause3 – 12.9.7\ufffd\ufffd\ufffd Sputtering and heating Subclause3 – 12.9.8\ufffd\ufffd\ufffd Sputter-enhanced diffusion Subclause2 – 12.10\ufffd\ufffd\ufffd Plasma etching Subclause2 – 12.11\ufffd\ufffd\ufffd Heating Subclause2 – 12.12\ufffd\ufffd\ufffd Ultraviolet radiation <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Clause1 – 13\ufffd\ufffd\ufffd Fracturing, cleaving and scribing Subclause2 – 13.1\ufffd\ufffd\ufffd Fracture Subclause3 – 13.1.1\ufffd\ufffd\ufffd General information Subclause3 – 13.1.2\ufffd\ufffd\ufffd Preparation of specimens Subclause2 – 13.2\ufffd\ufffd\ufffd Cleaving Subclause2 – 13.3\ufffd\ufffd\ufffd Scribing <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Clause1 – 14\ufffd\ufffd\ufffd Special specimen-handling techniques Subclause2 – 14.1\ufffd\ufffd\ufffd Prepumping of gassy specimens Subclause2 – 14.2\ufffd\ufffd\ufffd Viscous liquids Subclause2 – 14.3\ufffd\ufffd\ufffd Solute residue <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Bibliography – Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Surface chemical analysis. Guidelines for preparation and mounting of specimens for analysis<\/b><\/p>\n |