{"id":450620,"date":"2024-10-20T09:12:35","date_gmt":"2024-10-20T09:12:35","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-632512023\/"},"modified":"2024-10-26T17:10:06","modified_gmt":"2024-10-26T17:10:06","slug":"bs-en-iec-632512023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-632512023\/","title":{"rendered":"BS EN IEC 63251:2023"},"content":{"rendered":"

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
6<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
11<\/td>\n4 Test method
4.1 General
4.2 Test sample
Figures
Figure 1 \u2013 Schematic diagram of FOECB (top view) <\/td>\n<\/tr>\n
12<\/td>\n4.3 Test process
4.3.1 General description of the test
Figure 2 \u2013 Schematic diagrams of the FOECB test samples of fibre type
Figure 3 \u2013 Schematic diagram of the FOECB test samples of fibre type <\/td>\n<\/tr>\n
13<\/td>\n4.3.2 Preconditioning
4.3.3 Test
4.3.4 Recovery
Table 1 \u2013 Thermal endurance test class for FOECB <\/td>\n<\/tr>\n
14<\/td>\n4.3.5 Final measurements
5 Report <\/td>\n<\/tr>\n
15<\/td>\nAnnex A (informative)Example of optical bending loss test resultswith general glass optic fibres
Figure A.1 \u2013 Bending loss test setup
Figure A.2 \u2013 Optical loss versus bending diameter <\/td>\n<\/tr>\n
16<\/td>\nAnnex B (informative)Example of preparation method of O-E circuit test samples(optic fibre type)
B.1 General
B.2 Manufacturing processes of the FOECBs with optic fibres (POF, GOF)
Figure B.1 \u2013 Arrayed structure of the FOECB test samples formed on one sheet <\/td>\n<\/tr>\n
17<\/td>\nB.3 Manufacturing processes of the FOECBs with optical polymer waveguides
Figure B.2 \u2013 Fabrication of the optic circuits with optic fibres
Figure B.3 \u2013 Fabrication of the optic circuits with optic polymerwaveguide via the photo-etching method <\/td>\n<\/tr>\n
18<\/td>\nB.4 Characteristics of the optic fibres <\/td>\n<\/tr>\n
19<\/td>\nAnnex C (informative)Example of reflow assembly simulation test results
C.1 General
C.2 Results of reflow assembly simulation test for a LED chip mounted FOECB with GOF
Figure C.1 \u2013 LED chip mounted FOECB
Figure C.2 \u2013 Appearance of a LED chip mounted FOECB afterthe reflow assembly simulation test <\/td>\n<\/tr>\n
20<\/td>\nC.3 Results of reflow assembly simulation test for a transparent FOECB with GOF for display applications
C.4 Results of reflow assembly simulation test for a polyimide (PI) based FOECB with GOF
Figure C.3 \u2013 Appearance of a transparent FOECB with GOFs afterthe reflow assembly simulation test
Figure C.4 \u2013 Appearance of a PI based FOECB with GOF afterthe reflow assembly simulation test <\/td>\n<\/tr>\n
21<\/td>\nC.5 Results of reflow assembly simulation test for a polymer-based FOECB
Figure C.5 \u2013 Appearance of a polymer-based FOECB afterthe reflow assembly simulation test <\/td>\n<\/tr>\n
22<\/td>\nAnnex D (informative)Example of thermal shock endurance test results
D.1 General
D.2 Results of thermal shock endurance test for an FOECB with GOF
Figure D.1 \u2013 Appearance of an FOECB with GOF after the thermal shock test <\/td>\n<\/tr>\n
23<\/td>\nAnnex E (informative)Example of humidity storage test results
E.1 General
E.2 Results of humidity storage test for an FOECB with GOF
E.3 Results of humidity storage test for an FOECB with POF
Figure E.1 \u2013 Appearance of an FOECB with GOF after the humidity storage test <\/td>\n<\/tr>\n
24<\/td>\nFigure E.2 \u2013 Appearance of an FOECB with POF after the humidity storage test <\/td>\n<\/tr>\n
25<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2023<\/td>\n26<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":450625,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-450620","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/450620","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/450625"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=450620"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=450620"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=450620"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}