{"id":641585,"date":"2024-11-06T01:24:16","date_gmt":"2024-11-06T01:24:16","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/iso-ts-10303-4102006\/"},"modified":"2024-11-06T01:24:16","modified_gmt":"2024-11-06T01:24:16","slug":"iso-ts-10303-4102006","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/iso\/iso-ts-10303-4102006\/","title":{"rendered":"ISO\/TS 10303-410:2006"},"content":{"rendered":"<p>ISO\/TS 10303-410:2006 specifies the application module for<br \/>\n         AP210 electronic assembly interconnect and packaging design.       <\/p>\n<p>\n                  ISO\/TS 10303-410:2006 deals with the<br \/>\n            representation of requirements for, design of, and application of electrical and electrotechnical components, interconnect,<br \/>\n            and assemblies.<br \/>\n            \t   Included are capabilities to represent the various requirements and sources levied on these items,<br \/>\n            \t   as well as constraints arising from manufacturing processes.<br \/>\n            \t   Network and other analysis of proposed or actual design is supported, as is applications that map from the network listing<br \/>\n            to the layout.<br \/>\n            \t   Two dimensional and three dimensional assembly and interconnect design is supported,<br \/>\n            \t   as is microwave and embedded design.<\/p>\n<p>The following are within the scope of<br \/>\n         ISO\/TS 10303-410:2006:\n         <\/p>\n<ul>\n<li>the hierarchical description of the functionality of the electronic assembly or interconnect<br \/>\n            or devices that are used in an electronic assembly or interconnect;\n         <\/li>\n<li>the hierarchical description of the functional objects that are combinations of one or more<br \/>\n            functional objects;\n         <\/li>\n<li>the configuration management of the functional objects that are being developed concurrently;<\/li>\n<li>the configuration management of analytical models that are being developed concurrently;<\/li>\n<li>the explicit interface to analytic models that are used to define the behaviour of a functional<br \/>\n            object, a device, a physical object, an electronic assembly, or an interconnect;\n         <\/li>\n<li>the description of the connection among the functional objects;<\/li>\n<li>the description of the connection among the devices used in the electronic assembly or<br \/>\n            interconnect;\n         <\/li>\n<li>the description of the requirements for physical interconnection;<\/li>\n<li>the physical layout of the electronic assembly, including a description of the placement of<br \/>\n            the physical objects in the electronic assembly;\n         <\/li>\n<li>the description of the bare interconnect, including the conductive and non-conductive materials<br \/>\n            and patterns;\n         <\/li>\n<li>the functional and physical description of devices or physical objects, including material<br \/>\n            characteristics and composition;\n         <\/li>\n<li>the functional usage and physical usage description of devices or physical objects, including<br \/>\n            material characteristics and composition;\n         <\/li>\n<li>the functional and physical description of devices or physical objects realized as part of the<br \/>\n            interconnect, including material characteristics and composition;\n         <\/li>\n<li>the functional usage and physical usage description of devices or physical objects realized<br \/>\n            as part of the interconnect, including material characteristics and composition;\n         <\/li>\n<li>the description of the requirements and constraints on the design of the electronic assembly<br \/>\n            that assure product performance, incorporate quality, and enhance manufacturing process<br \/>\n            capabilities;\n         <\/li>\n<li>the description of the requirements and constraints on the design of the interconnect that<br \/>\n            assure product performance, incorporate quality, and enhance manufacturing process capabilities;\n         <\/li>\n<li>the configuration management of electronic assembly design descriptions;<\/li>\n<li>the configuration management of interconnect design descriptions;<\/li>\n<li>the allocation of certain details of the interconnect design description to the usage description<br \/>\n            of a physical object;\n         <\/li>\n<li>the allocation of certain details of the electronic assembly design description to the usage<br \/>\n            description of a physical object;\n         <\/li>\n<li>the description of electronic assemblies to implement various functional domains including,<br \/>\n            but not limited to, analogue, digital, video, radio frequency, and microwave;\n         <\/li>\n<li>the description of interconnect to implement various functional domains including, but not<br \/>\n            limited to, analogue, digital, video, radio frequency, and microwave;\n         <\/li>\n<li>the configuration management of constituent parts that are electronic assemblies or interconnect<br \/>\n            and that are being concurrently developed;\n         <\/li>\n<li>the configuration management of documents that contain requirements;<\/li>\n<li>the allocation of requirements to functional objects, physical objects, and the physical<br \/>\n            implementation;\n         <\/li>\n<li>the allocation of requirements from functional objects to their physical implementation;<\/li>\n<li>the allocation of each specific connection among the devices used in the electronic assembly<br \/>\n            to the component or group of components that realizes that connection;\n         <\/li>\n<li>the association of characteristics to functional objects, physical objects, and analytical<br \/>\n            models;\n         <\/li>\n<li>the identification of planned parameters for functional objects, electronic assemblies, interconnect,<br \/>\n            components, and analytical models;\n         <\/li>\n<li>the identification of actual parameters for functional objects, electronic assemblies, interconnect,<br \/>\n            components, and analytical models.\n         <\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p><b>Industrial automation systems and integration \u2014 Product data representation and exchange \u2014 Part 410: Application module: AP210 electronic assembly interconnect and packaging design<\/b><\/p>\n<table style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/iso\/\"><b>ISO<\/b><\/a><\/td>\n<td>2006-12<\/td>\n<td>NA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":0,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[385,2634],"product_tag":[],"class_list":{"0":"post-641585","1":"product","2":"type-product","3":"status-publish","5":"product_cat-25-040-40","6":"product_cat-iso","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/641585","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=641585"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=641585"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=641585"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}